Conference Year
Conference Month

Upcoming MDPI Conferences (3)

1–4 August 2024 The 1st International Conference on AI Sensors and The 10th International Symposium on Sensor Science


We are pleased to announce the 1st International Conference on AI Sensors and the 10th International Symposium on Sensor Science, held at the National University of Singapore, Singapore, from 1 to 4 August 2024.

This conference will provide leading scientists working in this field with a platform to share their latest research and engage in exciting discussions.

Conference Chairs
Prof. Chengkuo Lee, National University of Singapore;
Prof. Guangya Zhou, National University of Singapore;
Prof. Po-Liang Liu, National Chung-Hsing University.

The main topics of the conference include:

AIS Symposia
S1: Wearable AI Sensors
S2: Energy Harvesting Technology for Self-Sustained AIoT System
S3: Enabling Technologies for Neuromorphic Computing and Photonics Neural Networks S4: Haptic Technology for Future Metaverse Applications
S5: Advances in Intelligent Sensors and Robots for AI-Enhanced Applications - Industry 5.0, Digital Twin, Smart Homes, Healthcare, and Rehabilitation

I3S Workshops
W1: MEMS, NEMS and Edge Applications
W2: Metamaterials and Nanophotonics
W3: Sensors and IC Sensors Using CMOS MEMS and CMOS Compatible Materials
W4: Si Photonics for Sensing and Edge Computing
W5: Advanced Semiconductors and Heterogeneous Integration for Sensing Systems and Applications in 6G (e.g., compound semiconductors, 2D materials, chiplet, and system-in-package, etc.)
W6: Sensors, Implanted Energy Harvesters and Devices, and In-body IoT Technology for Prosthesis and Electroceuticals
W7: Sensors for Agriculture Applications and Harsh Environment
W8: Biosensors and Chemosensors
W9: Flexible, Stretchable and Wearable Sensors
W10: Self-Powered Sensors and Sensing Systems
W11: IoT Sensors and System Integration
W12: Advances in Sensor Applications
W13: MicroTAS and Lab-on-a-chip
W14: Industry Forum and Commercialization of Sensors and AI-Enabled Service

Important Dates
Deadline for abstract submission: 5 May 2024
Notification of acceptance: 15 May 2024
Early bird registration deadline: 10 June 2024

Guide for Authors
To submit your abstract, please click on the following link:

Registration information is coming soon.
Refer to the “Instructions for Authors” section for details regarding Abstract Submission and Publication Opportunities.

Submit your abstract here!
Register to the conference here!

For any inquiries regarding the event, please contact

Follow the conversation on Twitter with #AIS-I3S2024.

We look forward to seeing you at the AIS-I3S 2024.

18–20 June 2024 The 2nd International Electronic Conference on Machines and Applications (IECMA 2024)


Welcome from the Chair

Dear Colleagues,

It is our pleasure to invite you to join the 2nd International Electronic Conference on Machines and Applications (IECMA 2024) after the strong success of the previous annual online conference. IECMA 2024 will be held from 18-20 June 2024 and hosted online at

Machinery and engineering areas play a key role in an ever-increasingly technological society. Transportation, renewable energies, and more efficient buildings are only some of the domains where the intensive application of these systems has been most noticed. In all these applications, efficiency and reliability, automation and control, and advanced manufacturing are of major concern.

The scope of this online conference is to bring together well-known worldwide experts who are currently working on machinery and engineering and to provide an online forum for presenting and discussing new results.

Throughout this event, we aim to cover, among others, the following topics:

  • Additive Manufacturing
  • Condition Monitoring and Fault Diagnosis
  • Automation and Control Systems
  • Mechatronic and Intelligent Machines
  • Turbomachinery
  • Electrical Machines and Drives
  • Vehicle Dynamics and Control
  • Friction and Tribology

All accepted abstracts will be published on the website of the conference. You are required to submit an abstract (minimum 200—maximum 300-word limit). Please see the abstract guidelines in "Instructions for Authors".

After the conference, the participants may submit a full paper to MDPI’s Machines journal. After the review process, the authors of the accepted papers will receive a 20% discount on the APC before the paper is published in Machines.

On behalf of the Organizing Committee, we cordially invite you to join us at the 2nd International Electronic Conference on Machines and Applications (IECMA 2024).

We look forward to your contributions.

Prof. Dr. Antonio J. Marques Cardoso
Chair of the 2nd International Electronic Conference on Machines and Applications

4–6 November 2024 The 2nd International Electronic Conference on Actuator Technology


We cordially invite you to attend this event organized by MDPI Actuators (ISSN: 2076-0825, Impact Factor: 2.6). It will take place virtually on 4–6 November 2024, CET.

Conference Chairs
Prof. Dr. Kenji Uchino, The Pennsylvania State University, USA
Prof. Dr. André Preumont, Université Libre de Bruxelles, Belgium
Prof. Dr. Manfred Kohl, Institute of Microstructure Technology, Karlsruhe Institute of Technology (KIT), Germany

The Topics of Interest
S1. New actuator materials
S2. Innovative actuator designs
S3. Drive/control technologies
S4. Remarkable actuator applications

Important Dates
Deadline for abstract submission: 7th July 2024
Notification of acceptance: 7th August 2024
Deadline for Registration: 31st October 2024

Guide for Authors
To submit your abstract, please click on the following link:
To register for the event, please click on the following link:
For details regarding Abstract Submission, Poster and Slide Submission, and Publication Opportunities, you may refer to the “Instructions for Authors” section:

For any enquiries regarding the event, please contact

We look forward to seeing you at IECAT 2024.

Conference Year
Conference Month

Upcoming Partner Conferences (1)

27–29 June 2024 6th IFToMM Symposium on Mechanism Design for Robotics

Timişoara, Romania

Call for Papers

The aim of the Symposium on Mechanism Design for Robotics (MEDER 2021) is to bring together researchers, in-dustry professionals, and students from a broad range of disciplines related to mechanisms and robotics to share the latest developments and discuss the directions for the future of mechanism and robotics research. MEDER 2024 continues a successful series of symposiums that started in Mexico 2010, with subsequent events in China in 2012, in Denmark in 2015, in Italy in 2018, and in France in 2021. The conference will be held at the Conference Center and the buildings of the Mechanical Faculty of Politehnica at University of Timişoara in Timişoara, Romania.

Papers are solicited on topics related to mechanisms within aspects of theory, design, practice, and its applications for robotics, including but not limited to:
Mechanism design;
Mechanism education and history of MMS;
Theoretical and computational kinematics;
Experimental mechanics;
Mechanics of robots;
Control issues of mechanical systems;
Machine intelligence;
Innovative mechanisms and applications;
Linkages and manipulators;
Dynamics of machinery and multi-body systems.

Authors are kindly asked to submit original full papers with a recommended length of 8 pages in Springer format. Instructions will be available in the Symposium webpage. All accepted and presented papers will be published in a Scopus indexed book of the Springer Series Mechanisms and Machine Science, with the title: “Advances in Mechanism Design for Robots—MEDER 2024”. For each of three categories (Research, Applications, and Student), three awards (Gold, Silver, and Bronze) will be given to the best papers.

Full paper submission: January 31, 2024
Acceptance notification: March 15, 2024
Final paper submission: April 01, 2024

Early Registration (before April 15th, 2024):
IFToMM Members 250 Euro
Non IFToMM Members 300 Euro
Regular Registration (after April 15th, 2024):
IFToMM Members 300 Euro
Non IFToMM Members 350 Euro Students 150 Euro
Accompanying Persons 150 Euro
The registration fee includes the complete program of the MEDER 2024 conference and paper publication.

Timişoara provides accommodation in several hotels of different categories. Early reservation is recommended by directly contacting the Organizing Committee Secretariat. A list of hotels will soon be available on the site of the conference.

Technical Sponsors
TC for Robotics and Mechatronics
TC Linkages and Mechanical Controls

General Chairs:
Erwin-Christian Lovasz (România)
Marco Ceccarelli (Italy)  

National Organizing Committee
Ioan Doroftei (România)
Mircea Niţulescu (România)

Scientific Committee
Marco Ceccarelli (Italy, Chair)
Mario Acevedo (Mexico)
Shaoping Bai (Denmark)
B. Chedli Bouzgarrou (France)
Carl Nelson (USA)
Alba Perez (Spain)
Yan Jin (UK)
Erwin-Christian Lovasz (Romania)
Victor Petuya (Spain)
Yukio Takeda (Japan)
Ding Xilun (China)

Correspondence Address:
Prof.Dr.-Ing. Erwin-Christian Lovasz
Politehnica University of Timişoara
Bv.Mihai Viteazul nr.1
Ro-300222 Timişoara, Romania


Organized by
Politehnica University of Timisoara
Department of Mechatronics

Special Issue "Selected Papers from MEDER 2024: Advances in Mechanism Design for Robotics"

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