Thermal Behavior of Polymer Materials II

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Analysis and Characterization".

Deadline for manuscript submissions: 30 September 2024 | Viewed by 3071

Special Issue Editors


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Guest Editor
Atera Water Pte Ltd., 21 Toh Guan Road East, Singapore 608609, Singapore
Interests: polymer composites; thermal conductive materials; high performance fibre
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Guest Editor
College of Chemistry and Chemical Engineering, Wuhan Textile University, Wuhan, China
Interests: polymer rheology; multifunctional gel; flexible sensors
Department of Polymer Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
Interests: polymer rheology; multifunctional gel; flexible sensors

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School of Chemical Engineering, Advanced Research Institute of Materials Science, Changchun University of Technology, Jilin 130012, China
Interests: polymer composites; photoelectric polymers and devices; polymer fibers

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Guest Editor
Shanghai Collaborative Innovation Center for High Performance Fiber Composites, Center for Civil Aviation Composites, Donghua University, Shanghai 201620, China
Interests: electromagnetic shielding and absorbing materials; multifunctional fibers and composites

Special Issue Information

Dear Colleagues,

The way in which a polymer responds to external thermal energy is critical as it is closely related to its processing and applications. Therefore, when using polymer materials, their thermal properties, such as thermal stability, thermal transition, and thermal conductivity, are always in the top considerations. In recent years, polymers with extraordinary thermal properties have been extensively researched due to the pressing demand from various fields. For example, high-temperature-resistant polymers have created many new opportunities for applications in aerospace, automobiles and coatings; polymers with reversible thermal behaviors could be synthesized into multifunctional intelligent materials; highly thermally conductive polymers are desirable for electronic/electrical packaging, thermal interface materials and adhesives, while some low thermal conductivity polymeric materials can be used as high-performance thermoelectric materials. 

In this Special Issue, we call for academic publications on scientific advancements in the area of the thermal properties of polymer materials. Topics may include, but are not limited to, thermal stability and degradation behaviors of polymers, thermal conductivity, thermal expansion and applications of polymers in energy storage/conversion/transfer. Both original research manuscripts and reviews are accepted.

Dr. Xuelong Chen
Dr. Shuguang Bi
Dr. Sijun Liu
Prof. Dr. Shiwei Wang
Dr. Liying Zhang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thermal stability
  • degradation
  • thermal conductivity
  • thermal dissipation
  • polymer composite
  • thermoset
  • thermoplastic
  • heat transfer
  • interface
  • energy

Published Papers (3 papers)

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Research

22 pages, 7911 KiB  
Article
Glass Transition Temperatures and Thermal Conductivities of Polybutadiene Crosslinked with Randomly Distributed Sulfur Chains Using Molecular Dynamic Simulation
by Tannaz Alamfard, Tommy Lorenz and Cornelia Breitkopf
Polymers 2024, 16(3), 384; https://doi.org/10.3390/polym16030384 - 30 Jan 2024
Viewed by 600
Abstract
The thermal conductivities and glass transition temperatures of polybutadiene crosslinked with randomly distributed sulfur chains having different lengths from mono-sulfur (S1) to octa-sulfur (S8) were investigated. The thermal conductivities of the related models as a function of the heat flux autocorrelation function, applying [...] Read more.
The thermal conductivities and glass transition temperatures of polybutadiene crosslinked with randomly distributed sulfur chains having different lengths from mono-sulfur (S1) to octa-sulfur (S8) were investigated. The thermal conductivities of the related models as a function of the heat flux autocorrelation function, applying an equilibrium molecular dynamic (EMD) simulation and the Green–Kubo method, were studied for a wide range of temperatures. The influence of the length of sulfur chains, degree of crosslinking, and molar mass of the crosslinker on the glass transition temperature and final values of thermal conductivities were studied. First, the degree of crosslinking is considered constant for the eight simulation models, from mono-sulfur (S1) to octa-sulfur (S8), while the molar mass of the sulfur is increases. The results show that the thermal conductivities of the crosslinked structure decrease with increasing temperature for each model. Moreover, by increasing the lengths of the sulfur chains and the molar weight of the crosslinker, thermal conductivity increases at a constant temperature. The MD simulation demonstrates that the glass transition temperature and density of the crosslinked structure enhance as the length of the sulfur chains and molar mass of the sulfur increase. Second, the molar weight of sulfur is considered constant in these eight models; therefore, the degree of crosslinking decreases with the increase in the lengths of the sulfur chains. The results show that the thermal conductivities of the crosslinked structure decrease with the increase in the temperature for each model. Moreover, by increasing the lengths of sulfur chains and thus decreasing the degree of crosslinking, the trend in changes in thermal conductivities are almost the same for all of these models, so thermal conductivity is constant for a specific temperature. In addition, the glass transition temperature and density of the crosslinked structure decrease. Full article
(This article belongs to the Special Issue Thermal Behavior of Polymer Materials II)
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14 pages, 4880 KiB  
Article
Thermal Stability Improvement of Core Material via High Internal Phase Emulsion Gels
by Jinhua Hu, Yongxue Liang, Xueyao Huang, Guangxue Chen, Dingrong Liu, Zhuangzhuang Chen, Zheng Fang and Xuelong Chen
Polymers 2023, 15(21), 4272; https://doi.org/10.3390/polym15214272 - 30 Oct 2023
Viewed by 685
Abstract
Biocompatible particle-stabilized emulsions have gained significant attention in the biomedical industry. In this study, we employed dynamic high-pressure microfluidization (HPM) to prepare a biocompatible particle emulsion, which effectively enhances the thermal stability of core materials without the addition of any chemical additives. The [...] Read more.
Biocompatible particle-stabilized emulsions have gained significant attention in the biomedical industry. In this study, we employed dynamic high-pressure microfluidization (HPM) to prepare a biocompatible particle emulsion, which effectively enhances the thermal stability of core materials without the addition of any chemical additives. The results demonstrate that the HPM-treated particle-stabilized emulsion forms an interface membrane with high expansion and viscoelastic properties, thus preventing core material agglomeration at elevated temperatures. Furthermore, the particle concentration used for constructing the emulsion gel network significantly impacts the overall strength and stability of the material while possessing the ability to inhibit oxidation of the thermosensitive core material. This investigation explores the influence of particle concentration on the stability of particle-stabilized emulsion gels, thereby providing valuable insights for the design, improvement, and practical applications of innovative clean label emulsions, particularly in the embedding and delivery of thermosensitive core materials. Full article
(This article belongs to the Special Issue Thermal Behavior of Polymer Materials II)
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19 pages, 4154 KiB  
Article
Synthesis, Thermogravimetric Analysis, and Kinetic Study of Poly-N-Isopropylacrylamide with Varied Initiator Content
by Agnieszka Gola, Tomasz Knysak, Igor Mucha and Witold Musiał
Polymers 2023, 15(11), 2427; https://doi.org/10.3390/polym15112427 - 23 May 2023
Cited by 1 | Viewed by 1417
Abstract
The thermal decomposition and kinetic parameters of four polymers, PN-1, PN-05, PN-01, and PN-005, were determined by thermogravimetry (TGA/DTG) under non-isothermal conditions. N-isopropylacrylamide (NIPA)-based polymers were synthesized by the surfactant-free precipitation polymerization (SFPP) with different concentrations of the anionic initiator potassium persulphate [...] Read more.
The thermal decomposition and kinetic parameters of four polymers, PN-1, PN-05, PN-01, and PN-005, were determined by thermogravimetry (TGA/DTG) under non-isothermal conditions. N-isopropylacrylamide (NIPA)-based polymers were synthesized by the surfactant-free precipitation polymerization (SFPP) with different concentrations of the anionic initiator potassium persulphate (KPS). Thermogravimetric experiments were carried out in the temperature range of 25–700 °C at four heating rates, 5, 10, 15, and 20 °C min−1, under a nitrogen atmosphere. Poly NIPA (PNIPA) showed three stages of mass loss during the degradation process. The thermal stability of the test material was determined. Activation energy values were estimated using Ozawa, Kissinger, Flynn–Wall–Ozawa (FWO), Kissinger–Akahira–Sunose (KAS), and Friedman (FD) methods. Full article
(This article belongs to the Special Issue Thermal Behavior of Polymer Materials II)
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