Special Issue "Polymers for Thermally Challenging Applications"
Deadline for manuscript submissions: closed (31 July 2021) | Viewed by 526
Interests: functional polymers; ring-opening polymerizations; crosslinked polymers; biopolyesters; polymeranalogous modifications
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The thermal stability of polymers and polymer-based composites, which commonly is quantified by thermogravimetric analysis, is one of the key characteristics of such materials with respect to their applicability. Numerous properties of polymers and related composites, such as mechanical behavior (strength, toughness, and elasticity), water uptake, and crystallinity as prominent examples, vary with the temperature.
Due to the trend of miniaturization in various application fields such as microelectronics (Moore’s Law), increasing power-to-volume ratios and the inherent generation of continuously higher temperature peaks must be considered. Consequently, the thermal stability of polymers and related composites has gained much attention. In addition to the thermal stability of polymers, their thermal conductivity also plays a key role in thermally challenging applications: if the heat that is generated in a device can be removed from the polymer layer within a short time frame, the requirements for the thermal stability of such polymer layers are less demanding.
The thermal conductivity of polymers and polymer-based materials can be increased by, e.g., the addition of inorganic fillers with high thermal conductivity as well as the incorporation of oligophenylic units into the polymer structure. In such polymers and polymer-based composites, a significant alteration of the mechanic properties will occur. Consequently, the establishment of structure–property relationships for such polymers and related polymer-based composites has stimulated extensive scientific investigations.
Due to the high relevance of the thermal stability and thermal conductivity of polymers and polymer-based composites in current R&D activities, a Special Issue of the journal Polymers with the title ‘’Polymers for Thermally Challenging Applications’’ will be compiled, for which article submissions are cordially invited. Review articles, as well as original papers, will be considered for this Special Issue of Polymers.
Prof. Dr. Frank Wiesbrock
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Polymer-based composites
- Thermal stability
- Thermal conductivity
- Mechanical properties
- Brittleness of polymers and composites
- Structure–property relationships