Polymers for Thermally Challenging Applications
A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Analysis and Characterization".
Deadline for manuscript submissions: closed (31 July 2021) | Viewed by 618
Special Issue Editor
Interests: functional polymers; ring-opening polymerizations; crosslinked polymers; biopolyesters; polymeranalogous modifications
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The thermal stability of polymers and polymer-based composites, which commonly is quantified by thermogravimetric analysis, is one of the key characteristics of such materials with respect to their applicability. Numerous properties of polymers and related composites, such as mechanical behavior (strength, toughness, and elasticity), water uptake, and crystallinity as prominent examples, vary with the temperature.
Due to the trend of miniaturization in various application fields such as microelectronics (Moore’s Law), increasing power-to-volume ratios and the inherent generation of continuously higher temperature peaks must be considered. Consequently, the thermal stability of polymers and related composites has gained much attention. In addition to the thermal stability of polymers, their thermal conductivity also plays a key role in thermally challenging applications: if the heat that is generated in a device can be removed from the polymer layer within a short time frame, the requirements for the thermal stability of such polymer layers are less demanding.
The thermal conductivity of polymers and polymer-based materials can be increased by, e.g., the addition of inorganic fillers with high thermal conductivity as well as the incorporation of oligophenylic units into the polymer structure. In such polymers and polymer-based composites, a significant alteration of the mechanic properties will occur. Consequently, the establishment of structure–property relationships for such polymers and related polymer-based composites has stimulated extensive scientific investigations.
Due to the high relevance of the thermal stability and thermal conductivity of polymers and polymer-based composites in current R&D activities, a Special Issue of the journal Polymers with the title ‘’Polymers for Thermally Challenging Applications’’ will be compiled, for which article submissions are cordially invited. Review articles, as well as original papers, will be considered for this Special Issue of Polymers.
Prof. Dr. Frank Wiesbrock
Guest Editor
Manuscript Submission Information
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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- Polymers
- Polymer-based composites
- Thermal stability
- Thermal conductivity
- Mechanical properties
- Brittleness of polymers and composites
- Structure–property relationships
