Special Issue "Modeling, Testing and Reliability Issues in MEMS Engineering 2011"
A special issue of Micromachines (ISSN 2072-666X).
Deadline for manuscript submissions: closed (15 December 2011) | Viewed by 7102
Special Issue Editor
Interests: MEMS; smart materials; micromechanics; machine learning-driven materials modeling
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Micro-electro-mechanical-systems (MEMS) are devices on a millimeter scale, with micro-resolution. Each MEMS is given by the integration of mechanical elements, sensors, actuators and electronics on a common silicon substrate, obtained through micro-fabrication technology.
MEMS are often designed to work in mobile devices, and are therefore subject during their life to accidental mechanical loadings. Because of the MEMS size, multi-scale analyses are sometimes required in reliability analysis. Furthermore, also thermal, electrical, magnetic and environmental actions should be accounted for in a fully coupled multi-physics modelling of the devices.
As for packaging, some technical problems caused to the devices are not yet thoroughly understood and solved. Since standards do not necessarily apply to packaged MEMS, new knowledge-based testing methodologies need to be proposed.
Dr. Stefano Mariani
Guest Editor
Keywords
- micro-electro-mechanical-systems
- multi-scale and multi-physics modeling
- micro-fluidics
- failure analysis
- reliability analysis
- package engineering
Related Special Issue
- Modeling, Testing and Reliability Issues in MEMS Engineering 2011 in Sensors (14 articles)
