Recent Advances in Soft Electronic Materials and Devices

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A:Physics".

Deadline for manuscript submissions: closed (30 April 2024) | Viewed by 202

Special Issue Editor


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Guest Editor
Department of Electronics Engineering, College of Engineering, Pusan National University, Busan 46241, Republic of Korea
Interests: semiconductor devices and processes; organic semiconductors; neuromorphic devices; soft electronics

Special Issue Information

Dear Colleagues,

Notable progress has been made in developing soft electronic materials and devices. Owing to their superior mechanical characteristics, that is, being soft, flexible, bendable, stretchable, twistable, etc., soft electronics hold the potential to be implemented in health monitors, medical implants, artificial skins, human–machine interfaces, etc. Additionally, as wearable electronic devices become more prevalent, the need for the industrialization of soft electronics grows urgent, indicating that the soft electronics industry will not only remain in the realm of laboratories but will also reach the real world. With the rapid development of soft science and technologies, this Special Issue aims to collect articles on the latest progress in soft materials and electronics in sensing-, energy-, e-skin-, robot-, health-, and medical-related applications. This Special Issue also covers a broad range of fundamental concepts, as well as experimental and theoretical studies, related to flexibility and stretchability, as well as applications with new ideas for device architecture and new approaches for device performance.

Dr. Hyunseok Shim
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • novel soft materials
  • flexible and stretchable electronics
  • wearable electronics
  • soft systems
  • printing technologies for soft systems

Published Papers

There is no accepted submissions to this special issue at this moment.
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