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Micromachines
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NEMS/MEMS Devices and Applications
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NEMS/MEMS Devices and Applications

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".

Deadline for manuscript submissions: closed (25 March 2023) | Viewed by 25368

Special Issue Editors

Dr. Ching-Liang Dai

E-Mail Website
Guest Editor
Department of Mechanical Engineering, National Chung Hsing University, Taichung 402, Taiwan
Interests: CMOS-MEMS; microsensors; microactuators
Special Issues, Collections and Topics in MDPI journals
Dr. Yao-Chuan Tsai

E-Mail Website
Guest Editor
Department of Bio-Industrial Mechatronics Engineering, National Chung Hsing University, Taichung 402, Taiwan
Interests: micromachined sensors and actuators
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Recently, nanoelectromechanical system (NEMS) and microelectromechanical system (MEMS) technologies have been employed to develop various microdevices and microstructures. Many sensors and actuators have been manufactured and commercialized using the technologies, such as pressure sensors, accelerometers, gyroscopes, tactile sensors, thermal sensors, flow sensors, optical sensors, image sensors, microphones, magnetic sensors, chemical sensors, gas sensors, biosensors, microchannels, ink jet heads, optical switches, RF switches, micromirror, motors, relays, resonators, filters, and energy harvesters. NEMS/MEMS devices have been widely applied in various fields. This Special Issue aims to collect high-quality research results on NEMS/MEMS devices and applications. Submissions related to novel designs, fabrications, developments, and applications of various NEMS/MEMS devices, including physical sensors, chemical sensors, gas sensors, biosensors, actuators, energy harvesters, and others, based on NEMS/MEMS technologies, are welcome. Review articles and original research articles are equally welcome.

Dr. Ching-Liang Dai
Dr. Yao-Chuan Tsai
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • physical sensors
  • force sensors
  • magnetic sensors
  • optical sensors
  • microphones
  • flow sensors
  • thermal sensors
  • chemical sensors
  • biosensors
  • gas sensors
  • actuators
  • resonators/filters
  • switches/relays
  • energy harvesters
  • lens/mirrors

Related Special Issue

Published Papers (16 papers)

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Research

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18 pages, 4544 KiB  
Article
Design and Measurement of Microelectromechanical Three-Axis Magnetic Field Sensors Based on the CMOS Technique
by Chi-Han Wu, Cheng-Chih Hsu, Yao-Chuan Tsai, Chi-Yuan Lee and Ching-Liang Dai
Micromachines 2023, 14(5), 1038; https://doi.org/10.3390/mi14051038 - 12 May 2023
Viewed by 924
Abstract
The design, fabrication, and measurement of a microelectromechanical system (MEMS) three-axis magnetic field sensor (MFS) based on the commercial complementary metal oxide semiconductor (CMOS) process are investigated. The MFS is a magnetic transistor type. The performance of the MFS was analyzed employing the [...] Read more.
The design, fabrication, and measurement of a microelectromechanical system (MEMS) three-axis magnetic field sensor (MFS) based on the commercial complementary metal oxide semiconductor (CMOS) process are investigated. The MFS is a magnetic transistor type. The performance of the MFS was analyzed employing the semiconductor simulation software, Sentaurus TCAD. In order to decrease the cross-sensitivity of the three-axis MFS, the structure of the MFS is planed to accommodate two independent sensing components, a z-MFS utilized to sense magnetic field (M-F) in the z-direction and a y/x-MFS composed of a y-MFS and a x-MFS to be utilized to sense M-F in the y- and x-directions. The z-MFS incorporates four additional collectors to increase its sensitivity. The commercial 1P6M 0.18 μm CMOS process of the Taiwan Semiconductor Manufacturing Company (TSMC) is utilized to manufacture the MFS. Experiments depict that the MFS has a low cross-sensitivity of less than 3%. The sensitivities of z-, y-, and x-MFS are 237 mV/T, 485 mV/T, and 484 mV/T, respectively. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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13 pages, 8123 KiB  
Article
Giant Magnetoimpedance Effect of Multilayered Thin Film Meanders Formed on Flexible Substrates
by Mengyu Liu, Zhenbao Wang, Ziqin Meng, Xuecheng Sun, Yong Huang, Yongbin Guo and Zhen Yang
Micromachines 2023, 14(5), 1002; https://doi.org/10.3390/mi14051002 - 06 May 2023
Cited by 3 | Viewed by 1460
Abstract
The giant magnetoimpedance effect of multilayered thin films under stress has great application prospects in magnetic sensing, but related studies are rarely reported. Therefore, the giant magnetoimpedance effects in multilayered thin film meanders under different stresses were thoroughly investigated. Firstly, multilayered FeNi/Cu/FeNi thin [...] Read more.
The giant magnetoimpedance effect of multilayered thin films under stress has great application prospects in magnetic sensing, but related studies are rarely reported. Therefore, the giant magnetoimpedance effects in multilayered thin film meanders under different stresses were thoroughly investigated. Firstly, multilayered FeNi/Cu/FeNi thin film meanders with the same thickness were manufactured on polyimide (PI) and polyester (PET) substrates by DC magnetron sputtering and MEMS technology. The characterization of meanders was analyzed by SEM, AFM, XRD, and VSM. The results show that multilayered thin film meanders on flexible substrates also have the advantages of good density, high crystallinity, and excellent soft magnetic properties. Then, we observed the giant magnetoimpedance effect under tensile and compressive stresses. The results show that the application of longitudinal compressive stress increases the transverse anisotropy and enhances the GMI effect of multilayered thin film meanders, while the application of longitudinal tensile stress yields the opposite result. The results provide novel solutions for the fabrication of more stable and flexible giant magnetoimpedance sensors, as well as for the development of stress sensors. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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13 pages, 4899 KiB  
Article
Novel Grey Body for Accurate Radiometric Measurements
by Moshe Avraham, Gady Golan and Yael Nemirovsky
Micromachines 2023, 14(5), 974; https://doi.org/10.3390/mi14050974 - 29 Apr 2023
Viewed by 924
Abstract
This study presents an original approach on how to generate a radiator with an emissivity less than one by using a conventional blackbody and a screen with a defined area density of holes. This is needed for the calibration of infrared (IR) radiometry, [...] Read more.
This study presents an original approach on how to generate a radiator with an emissivity less than one by using a conventional blackbody and a screen with a defined area density of holes. This is needed for the calibration of infrared (IR) radiometry, which is a very useful form of temperature measurement in industrial, scientific, and medical applications. One of the major sources of errors in IR radiometry is the emissivity of the surface being measured. Emissivity is a physically well-defined parameter, but in real experiments, it may be influenced by many factors: surface texture, spectral properties, oxidation, and aging of surfaces. While commercial blackbodies are prevalent, the much-needed grey bodies with a known emissivity are unavailable. This work describes a methodology for how to calibrate radiometers in the lab or in the factory or FAB using the “screen approach” and a novel thermal sensor dubbed Digital TMOS. The fundamental physics required to appreciate the reported methodology is reviewed. The linearity in emissivity of the Digital TMOS is demonstrated. The study describes in detail how to obtain the perforated screen as well as how to do the calibration. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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15 pages, 5867 KiB  
Article
Design and Simulation of Microbolometer with Dual Cavity for High Figure of Merits
by Kevin O. Díaz Aponte, Yanan Xu and Mukti Rana
Micromachines 2023, 14(5), 948; https://doi.org/10.3390/mi14050948 - 27 Apr 2023
Cited by 1 | Viewed by 1553
Abstract
The rapid expansion of the applications of infrared (IR) sensing in the commercial market has driven the need to develop new materials and detector designs for enhanced performance. In this work, we describe the design of a microbolometer that uses two cavities to [...] Read more.
The rapid expansion of the applications of infrared (IR) sensing in the commercial market has driven the need to develop new materials and detector designs for enhanced performance. In this work, we describe the design of a microbolometer that uses two cavities to suspend two layers (sensing and absorber). Here, we implemented the finite element method (FEM) from COMSOL Multiphysics to design the microbolometer. We varied the layout, thickness, and dimensions (width and length) of different layers one at a time to study the heat transfer effect for obtaining the maximum figure of merit. This work reports the design, simulation, and performance analysis of the figure of merit of a microbolometer that uses GexSiySnzOr thin films as the sensing layer. From our design, we obtained an effective thermal conductance of 1.0135×10−7 W/K, a time constant of 11 ms, responsivity of 5.040×105 V/W, and detectivity of 9.357×107 cm−Hz1/2/W considering a 2 μA bias current. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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16 pages, 4228 KiB  
Article
High-Speed Temperature Control Method for MEMS Thermal Gravimetric Analyzer Based on Dual Fuzzy PID Control
by Xiaoyang Zhang, Zhi Cao, Shanlai Wang, Lei Yao and Haitao Yu
Micromachines 2023, 14(5), 929; https://doi.org/10.3390/mi14050929 - 25 Apr 2023
Viewed by 1189
Abstract
The traditional thermal gravimetric analyzer (TGA) has a noticeable thermal lag effect, which restricts the heating rate, while the micro-electro-mechanical system thermal gravimetric analyzer (MEMS TGA) utilizes a resonant cantilever beam structure with high mass sensitivity, on-chip heating, and a small heating area, [...] Read more.
The traditional thermal gravimetric analyzer (TGA) has a noticeable thermal lag effect, which restricts the heating rate, while the micro-electro-mechanical system thermal gravimetric analyzer (MEMS TGA) utilizes a resonant cantilever beam structure with high mass sensitivity, on-chip heating, and a small heating area, resulting in no thermal lag effect and a fast heating rate. To achieve high-speed temperature control for MEMS TGA, this study proposes a dual fuzzy proportional-integral-derivative (PID) control method. The fuzzy control adjusts the PID parameters in real-time to minimize overshoot while effectively addressing system nonlinearities. Simulation and actual testing results indicate that this temperature control method has a faster response speed and less overshoot compared to traditional PID control, significantly improving the heating performance of MEMS TGA. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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20 pages, 7471 KiB  
Article
Application of MEMS Accelerometers in Dynamic Vibration Monitoring of a Vehicle
by Hasnet Eftakher Ahmed, Sahereh Sahandabadi, Bhawya and Mohammed Jalal Ahamed
Micromachines 2023, 14(5), 923; https://doi.org/10.3390/mi14050923 - 24 Apr 2023
Cited by 5 | Viewed by 2702
Abstract
In this paper, the viability of MEMS accelerometers is investigated to measure vibration parameters related to different locations of a vehicle with respect to the automotive dynamic functions. The data is collected to compare the accelerometer performances in different locations on the vehicle, [...] Read more.
In this paper, the viability of MEMS accelerometers is investigated to measure vibration parameters related to different locations of a vehicle with respect to the automotive dynamic functions. The data is collected to compare the accelerometer performances in different locations on the vehicle, including on the hood above the engine, on the hood above the radiator fan, over the exhaust pipe, and on the dashboard. The power spectral density (PSD), together with the time and frequency domain results, confirm the strength and frequencies of the sources of vehicle dynamics. The frequencies obtained from the vibrations of the hood above the engine and radiator fan are approximately 44.18 Hz and 38 Hz, respectively. In terms of the vibration amplitude, the measured amplitudes are between 0.5 g and 2.5 g in both cases. Furthermore, the time domain data collected on the dashboard during driving mode reflects the road condition. Overall, the knowledge obtained from the various tests conducted in this paper can be advantageous for further control and development of vehicle diagnostics, safety, and comfort. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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15 pages, 3441 KiB  
Article
Adaptive Dynamic Analysis of MEMS Gyroscope Random Noise Based on PID-DAVAR
by Jianing Zhang, Pinghua Li, Zhiyu Yu, Jinghao Liu, Xiaoyang Zhang and Xuye Zhuang
Micromachines 2023, 14(4), 792; https://doi.org/10.3390/mi14040792 - 31 Mar 2023
Cited by 1 | Viewed by 1250
Abstract
As a MEMS gyroscope is susceptible to environmental interference, its performance is degraded due to random noise. Accurate and rapid analysis of random noise of MEMS gyroscope is of great significance to improve the gyroscope’s performance. A PID-DAVAR adaptive algorithm is designed by [...] Read more.
As a MEMS gyroscope is susceptible to environmental interference, its performance is degraded due to random noise. Accurate and rapid analysis of random noise of MEMS gyroscope is of great significance to improve the gyroscope’s performance. A PID-DAVAR adaptive algorithm is designed by combining the PID principle with DAVAR. It can adaptively adjust the length of the truncation window according to the dynamic characteristics of the gyroscope’s output signal. When the output signal fluctuates drastically, the length of the truncation window becomes smaller, and the mutation characteristics of the intercepted signal are analyzed detailed and thoroughly. When the output signal fluctuates steadily, the length of the truncation window becomes larger, and the intercepted signals are analyzed swiftly and roughly. The variable length of the truncation window ensures the confidence of the variance and shortens the data processing time without losing the signal characteristics. Experimental and simulation results show that the PID-DAVAR adaptive algorithm can shorten the data processing time by 50%. The tracking error of the noise coefficients of angular random walk, bias instability, and rate random walk is about 10% on average, and the minimum error is about 4%. It can accurately and promptly present the dynamic characteristics of the MEMS gyroscope’s random noise. The PID-DAVAR adaptive algorithm not only satisfies the requirement of variance confidence but also has a good signal-tracking ability. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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15 pages, 2160 KiB  
Article
A Generalized Model for Curved Nanobeams Incorporating Surface Energy
by Mahmoud E. Khater
Micromachines 2023, 14(3), 663; https://doi.org/10.3390/mi14030663 - 16 Mar 2023
Cited by 2 | Viewed by 844
Abstract
This work presents a comprehensive model for nanobeams, incorporating beam curvature and surface energy. Gurtin–Murdoch surface stress theory is used, in conjunction with Euler–Bernoulli beam theory, to model the beams and take surface energy effects into consideration. The model was validated by contrasting [...] Read more.
This work presents a comprehensive model for nanobeams, incorporating beam curvature and surface energy. Gurtin–Murdoch surface stress theory is used, in conjunction with Euler–Bernoulli beam theory, to model the beams and take surface energy effects into consideration. The model was validated by contrasting its outcomes with experimental data published in the literature on the static bending of fixed–fixed and fixed–free nanobeams. The outcomes demonstrated that surface stress alters the stiffness of both fixed–fixed and fixed–free nanobeams with different behaviors in each case. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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15 pages, 8145 KiB  
Article
Ultramicro Interdigitated Array Electrode Chip with Optimized Construction for Detection of Ammonia Nitrogen in Water
by Haifei Zhao, Yang Li, Aobo Cong, Jianhua Tong and Chao Bian
Micromachines 2023, 14(3), 629; https://doi.org/10.3390/mi14030629 - 10 Mar 2023
Cited by 5 | Viewed by 1170
Abstract
Ammonia nitrogen is a common contaminant in water and its determination is important for environmental protection. In this paper, an electrochemical sensor based on an ultramicro interdigitated array electrode (UIAE) chip with optimized construction was fabricated with Micro-Electro-Mechanical System (MEMS) technology and developed [...] Read more.
Ammonia nitrogen is a common contaminant in water and its determination is important for environmental protection. In this paper, an electrochemical sensor based on an ultramicro interdigitated array electrode (UIAE) chip with optimized construction was fabricated with Micro-Electro-Mechanical System (MEMS) technology and developed to realize the detection of ammonia nitrogen in water. The effects of spacing-to-width ratio and width of the working electrode on UIAE’s electrochemical characteristics and its ammonia nitrogen detection performance were studied by finite element simulation and experiment. The results demonstrated that the smaller the spacing-to-width ratio, the stronger generation–collection effect, and the smaller the electrode width, the stronger the edge effect, which led to an easier steady-state reach, a higher response current, and better ammonia nitrogen determination performance. The fabricated UIAE chip with optimized construction showed the linear detection range of 0.15 mg/L~2.0 mg/L (calculated as N), the sensitivity of 0.4181 μA·L·mg−1, and good anti-interference performance, as well as a long lifetime. UIAE based on bare Pt was successfully applied to ammonia nitrogen detection in water by optimizing structure, which might broaden the methods of ammonia nitrogen detection in water. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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9 pages, 2820 KiB  
Article
The Design of a Novel 2-42 GHz MEMS True-Time Delay Network for Wideband Phased Array Systems
by Qiannan Wu, Zemin Shi, Xudong Gao, Jing Li, Yongxin Zhan, Guangzhou Zhu, Junqiang Wang and Mengwei Li
Micromachines 2023, 14(2), 246; https://doi.org/10.3390/mi14020246 - 18 Jan 2023
Cited by 1 | Viewed by 1272
Abstract
This article presents the design method of a compact MEMS switched-line true-time delay line (TTDL) network over a wide frequency range extending from 2 to 42 GHz using TTDL units. The TTDL units, namely the cascading radio frequency micro-electromechanical system (RF MEMS) switches [...] Read more.
This article presents the design method of a compact MEMS switched-line true-time delay line (TTDL) network over a wide frequency range extending from 2 to 42 GHz using TTDL units. The TTDL units, namely the cascading radio frequency micro-electromechanical system (RF MEMS) switches and GCPW, were employed in the proposed TTDL network to improve the delay-bandwidth product (DBW) while maintaining its compact size and low delay variation (DV). For comparison, a theoretical analysis of the RF MEMS switch was performed while observing the switch performance with various top electrodes. The MEMS TTDL network has a compact size of 5 mm × 5 mm, with a maximum delay of 200 ps and a minimum of 30 ps. The maximum insertion loss of 9 states is 10 dB, and the in/out return loss is better than 20 dB across 2-42 GHz. The group delay variations are within ±2.5% for all the delay states over the operating frequency range. To the best of our knowledge, the proposed TTDL network obtains the most control bits among the TTDL networks offered to date. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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13 pages, 6972 KiB  
Article
Design, Simulation, and Fabrication of a New Three-Axis Inertial Switch with a Triangular Movable Electrode Structure
by Wenguo Chen, Rui Wang, Huiying Wang and Zhen Yang
Micromachines 2023, 14(1), 94; https://doi.org/10.3390/mi14010094 - 30 Dec 2022
Cited by 1 | Viewed by 984
Abstract
A new three-axis inertial switch is proposed. The triangle-structured movable electrode is designed to improve the inertial switch’s dynamic response performance, especially the movable electrode’s dynamic stability performance. The static mechanical analysis indicated that the displacement of the movable electrode to the fixed [...] Read more.
A new three-axis inertial switch is proposed. The triangle-structured movable electrode is designed to improve the inertial switch’s dynamic response performance, especially the movable electrode’s dynamic stability performance. The static mechanical analysis indicated that the displacement of the movable electrode to the fixed electrode in the sensitive direction is the minimum when the acceleration is applied to this designed inertial switch. The dynamic simulation analysis showed that the threshold of the designed inertial is about 235 g. The threshold in the non-sensitive direction is about 240 g, 270 g, 300 g, and 350 g when the directions of applied acceleration deviate 15°, 30°, 45°, and 60° from the sensitive direction, respectively. These results indicated that the designed inertial could resist the impact in non-sensitive directions and improve the stability in sensitive directions. The prototype of the inertial switch was fabricated and tested successfully. The testing results indicate that the threshold of the fabricated inertial switch is about 219 g. The test results verify the dynamic stability performance of the designed inertial switch. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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13 pages, 5525 KiB  
Article
High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating
by Jianhan Fan, Sen Lu, Jianxiao Zou, Kaiming Yang, Yu Zhu and Kaiji Liao
Micromachines 2022, 13(12), 2159; https://doi.org/10.3390/mi13122159 - 07 Dec 2022
Cited by 1 | Viewed by 2002
Abstract
This paper investigates a moiré-based mark for high-precision wafer bonding alignment. During alignment, the mark is combined with digital grating, which has the benefits of high precision and small size. A digital grating is superimposed on the mark to generate moiré fringes. By [...] Read more.
This paper investigates a moiré-based mark for high-precision wafer bonding alignment. During alignment, the mark is combined with digital grating, which has the benefits of high precision and small size. A digital grating is superimposed on the mark to generate moiré fringes. By performing a phase calculation on the moiré fringe images corresponding to the upper and lower wafers, the relative offset of the upper and lower wafers can be accurately calculated. These moiré fringes are exceptionally stable, thereby enhancing the alignment stability. In this study, through practical experiments, we tested the rationality and practicability of the mark. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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8 pages, 2776 KiB  
Article
The Design and Fabrication of a MEMS Electronic Calibration Chip
by Qiannan Wu, Yu Chen, Qianlong Cao, Jingchao Zhao, Shanshan Wang, Junqiang Wang and Mengwei Li
Micromachines 2022, 13(12), 2139; https://doi.org/10.3390/mi13122139 - 03 Dec 2022
Viewed by 1243
Abstract
During the test of microelectromechanical system (MEMS) devices, calibration of test cables, loads and test instruments is an indispensable step. Calibration kits with high accuracy, great operability and small loss can reduce the systematic errors in the test process to the greatest extent [...] Read more.
During the test of microelectromechanical system (MEMS) devices, calibration of test cables, loads and test instruments is an indispensable step. Calibration kits with high accuracy, great operability and small loss can reduce the systematic errors in the test process to the greatest extent and improve the measurement accuracy. Aiming at the issues of the conventional discrete calibration piece unit, which presents cumbersome calibration steps and large system loss, an integrated electronic calibration chip based on frequency microelectromechanical system (RF MEMS) switches is designed and fabricated. The short-open-load-through (SOLT) calibration states can be completed on a single chip, step by step, by adjusting the on–off state of the RF MEMS switches. The simulation results show that the operating frequency of the electronic calibration piece covers the range of DC~26.5 GHz, the insertion loss in through (thru) state is less than 0.2 dB, the return loss is less than 1.0 dB in short-circuit and open-circuit states, the return loss under load-circuit state is less than 20 dB and its size is only 2.748 mm × 2.2 mm × 0.5 mm. This novel calibration chip design has certain esteem for advancing calibration exactness and effectiveness. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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14 pages, 2935 KiB  
Article
Optimization of Processing Parameters and Adhesive Properties of Aluminum Oxide Thin-Film Transition Layer for Aluminum Substrate Thin-Film Sensor
by Yongjuan Zhao, Wenge Wu, Yunping Cheng and Wentao Yan
Micromachines 2022, 13(12), 2115; https://doi.org/10.3390/mi13122115 - 30 Nov 2022
Viewed by 1243
Abstract
A thin-film strain micro-sensor is a cutting force sensor that can be integrated with tools. Its elastic substrate is an important intermediate to transfer the strain generated by the tools during cutting to the resistance-grid-sensitive layer. In this paper, 1060 aluminum is selected [...] Read more.
A thin-film strain micro-sensor is a cutting force sensor that can be integrated with tools. Its elastic substrate is an important intermediate to transfer the strain generated by the tools during cutting to the resistance-grid-sensitive layer. In this paper, 1060 aluminum is selected as the elastic substrate material and aluminum oxide thin film is selected as the transition layer between the aluminum substrate and the silicon nitride insulating layer. The Stoney correction formula applicable to the residual stress of the aluminum oxide film is derived, and the residual stress of the aluminum oxide film on the aluminum substrate is obtained. The influence of Sputtering pressure, argon flow and negative substrate bias process parameters on the surface quality and sputtering power of the aluminum oxide thin film is discussed. The relationship model between process parameters, surface roughness, and sputtering rate of thin films is established. The sputtering process parameters for preparing an aluminum oxide thin film are optimized. The micro-surface quality of the aluminum oxide thin film obtained before and after the optimization of the process parameters and the surface quality of Si3N4 thin film sputtered on alumina thin film before and after the optimization are compared. It is verified that the optimized process parameters of aluminum oxide film as a transition layer can improve the adhesion between the insulating-layer silicon nitride film and the aluminum substrate. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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11 pages, 1217 KiB  
Article
A Normalized Model of a Microelectromechanical Relay Calibrated by Laser-Doppler Vibrometry
by Jessica Marvin, Michael Jang, Daniel Contreras and Matthew Spencer
Micromachines 2022, 13(10), 1728; https://doi.org/10.3390/mi13101728 - 13 Oct 2022
Viewed by 1126
Abstract
This work presents a behavioral model for a microelectromechanical (MEM) relay for use in circuit simulation. Models require calibration, and other published relay models require over a dozen parameters for calibration, many of which are difficult to extract or are only available after [...] Read more.
This work presents a behavioral model for a microelectromechanical (MEM) relay for use in circuit simulation. Models require calibration, and other published relay models require over a dozen parameters for calibration, many of which are difficult to extract or are only available after finite element analysis. This model improves on prior work by taking advantage of model normalization, which often results in models that require fewer parameters than un-normalized models. This model only needs three parameters extracted from experiment and one dimension known from device fabrication to represent its non-contact behavior, and two additional extracted parameters to represent its behavior when in contact. The extracted parameters–quality factor, resonant frequency, and the pull-in voltage–can be found using laser Doppler vibrometry. The device dimension is the actuation gap size, which comes from process data. To demonstrate this extraction process, a series of velocity step responses were excited in MEM relays, the measured velocity responses were used to calibrate the model, and then then simulations of the model (implemented in Verilog-A) were compared against the measured data. The error in the simulated oscillation frequency and peak velocity, two values selected as figures of merit, is less than 10% across many operating voltages. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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25 pages, 4865 KiB  
Review
Recent Trends in Structures and Interfaces of MEMS Transducers for Audio Applications: A Review
by Alessandro Gemelli, Marco Tambussi, Samuele Fusetto, Antonio Aprile, Elisabetta Moisello, Edoardo Bonizzoni and Piero Malcovati
Micromachines 2023, 14(4), 847; https://doi.org/10.3390/mi14040847 - 14 Apr 2023
Cited by 8 | Viewed by 3944
Abstract
In recent years, Micro-Electro-Mechanical Systems (MEMS) technology has had an impressive impact in the field of acoustic transducers, allowing the development of smart, low-cost, and compact audio systems that are employed in a wide variety of highly topical applications (consumer devices, medical equipment, [...] Read more.
In recent years, Micro-Electro-Mechanical Systems (MEMS) technology has had an impressive impact in the field of acoustic transducers, allowing the development of smart, low-cost, and compact audio systems that are employed in a wide variety of highly topical applications (consumer devices, medical equipment, automotive systems, and many more). This review, besides analyzing the main integrated sound transduction principles typically exploited, surveys the current State-of-the-Art scenario, presenting the recent performance advances and trends of MEMS microphones and speakers. In addition, the interface Integrated Circuits (ICs) needed to properly read the sensed signals or, on the other hand, to drive the actuation structures are addressed with the aim of offering a complete overview of the currently adopted solutions. Full article
(This article belongs to the Special Issue NEMS/MEMS Devices and Applications)
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