Special Issue "Selected Papers from the 6th International Conference on Electronics Technology (ICET 2023)"

A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: closed (31 August 2023) | Viewed by 165

Special Issue Editors

State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, China
Interests: flexible devices; functional thin film devices; terahertz spectroscopy

Special Issue Information

Dear Colleagues,

The International Conference on Electronics Technology (ICET) is annually held in Chengdu, China. It is co-sponsored by the Sichuan Institute of Electronics and IEEE, technically co-sponsored by the Chengdu Section, Chengdu Section SSC/CAS Joint Chapter, Chengdu Section AP/EMC Chapter and Chengdu Section SP Chapter, with the support of the University of Electronic Science and Technology of China, Sichuan University, Southwest Jiaotong University, Xi’an University of Technology, Singapore Institute of Electronics, etc. The primary aim of the ICET conference is to offer an academic platform for senior and young scientists from all over the world to exchange research ideas and share knowledge, development and experiences on topics related to their experimental and theoretical work in the very wide-spread field of electronics and micro/nanoelectronics technology and electronic packaging in a convenient and multicultural atmosphere.

This Special Issue in Micromachines contains extended papers from the 6th International Conference on Electronics Technology (ICET 2023) held on 12–15 May 2023 in Chengdu, China (http://icet.net/).

Topics of interest include, but are not limited to, the following:

  • Antennas and Microwaves;
  • Electronics and Micro/Nanoelectronics Technology;
  • Electronic Packaging;
  • Electronics Materials and Devices;
  • Aerospace and Electronics Systems;
  • Electronics Applications;
  • Sensors and Sensing Devices;
  • Communication and Network Components;
  • Integrated Circuit Technology and Miniaturized Electronic Systems.

Prof. Dr. Yuan Lin
Prof. Dr. Yi Zhang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • micro/nanoelectronics
  • electronics materials and devices
  • miniaturized electronic systems

Published Papers

There is no accepted submissions to this special issue at this moment.
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