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Micromachines
Special Issues
Piezoelectric Materials, Devices and Integrated Systems
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Piezoelectric Materials, Devices and Integrated Systems

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".

Deadline for manuscript submissions: closed (30 January 2024) | Viewed by 2869

Special Issue Editors

Dr. Dongdong Chen

E-Mail Website
Guest Editor
School of Microelectronics, Xidian University, Xi’an 710071, China
Interests: piezoelectric materials and transducers; integrated circuits; design and fabrication of microsystem; intelligent optimization algorithms and its applications
Special Issues, Collections and Topics in MDPI journals
Dr. Di Li

E-Mail Website
Guest Editor
School of Microelectronics, Xidian University, Xi’an 710071, China
Interests: integrated circuits design; RFIC design; mixed signal IC design and data converters
Special Issues, Collections and Topics in MDPI journals
Dr. Tianlong Zhao

E-Mail Website
Guest Editor
School of Microelectronics, Xidian University, Xi’an 710071, China
Interests: 2D semiconductor materials and devices; first-principles calculations; semiconductor device reliability; piezoelectric materials and devices
Special Issues, Collections and Topics in MDPI journals
Dr. Yi Quan

E-Mail Website
Guest Editor
School of Microelectronics, Xidian University, Xi’an 710071, China
Interests: development of novel lead-free piezoelectric materials; the grain orientation-controlled piezoelectric ceramics; design and fabrication of high-frequency ultrasonic transducers, and acoustic biomedical applications

Special Issue Information

Dear Colleagues,

All interested researchers are invited to contribute to this Special Issue with their original research articles, communications and review articles. Manuscripts will be internationally peer-reviewed. Please note that all submitted papers must be within the general scope of the Micromachines journal.

Topics may include, but are not limited to, the following:

  • Novel methods for the preparation of piezoelectric materials;
  • Novel modelling and design methods of piezoelectric devices;
  • Integrated circuit design for piezoelectric applications;
  • Simulation and design methods of 3D-integrated systems;
  • Promising applications of piezoelectric materials, devices, and integrated systems.

Dr. Dongdong Chen
Dr. Di Li
Dr. Tianlong Zhao
Dr. Yi Quan
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • piezoelectric materials
  • piezoelectric devices
  • integrated circuits
  • integrated systems
  • mathematical models
  • optimization algorithms
  • intelligent design
  • advanced processes
  • 3D integration

Published Papers (2 papers)

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Research

13 pages, 13170 KiB  
Article
Indocyanine Green-Loaded Liposomes-Assisted Photoacoustic Computed Tomography for Evaluating In Vivo Tumor Penetration of Liposomal Nanocarriers
by Chenjun Wu, Qi Sun, Xiangdong Liu, Xin Sun, Zeyu Chen and Han Shan
Micromachines 2024, 15(1), 90; https://doi.org/10.3390/mi15010090 - 30 Dec 2023
Viewed by 1185
Abstract
Liposomes possess the potential to enhance drug solubility, prolong the duration of circulation, and augment drug accumulation at the tumor site through passive and active targeting strategies. However, there is a lack of studies examining the in vivo tumor penetration capabilities of liposomes [...] Read more.
Liposomes possess the potential to enhance drug solubility, prolong the duration of circulation, and augment drug accumulation at the tumor site through passive and active targeting strategies. However, there is a lack of studies examining the in vivo tumor penetration capabilities of liposomes of varying sizes, which hampers the development of drug delivery systems utilizing liposomal nanocarriers. Here, we present an indocyanine green (ICG)-loaded liposomes-assisted photoacoustic computed tomography (PACT) for directly evaluating the tumor penetration ability of liposomal nanocarriers in vivo. Through the utilization of microfluidic mixing combined with extrusion techniques, we successfully prepare liposomes encapsulating ICG in both large (192.6 ± 8.0 nm) and small (61.9 ± 0.6 nm) sizes. Subsequently, we designed a dual-wavelength PACT system to directly monitor the in vivo tumor penetration of large- and small-size ICG-encapsulated liposomes. In vivo PACT experiments indicate that ICG-loaded liposomes of smaller size exhibit enhanced penetration capability within tumor tissues. Our work presents a valuable approach to directly assess the penetration ability of liposomal nanocarriers in vivo, thereby facilitating the advancement of drug delivery systems with enhanced tumor penetration and therapeutic efficacy. Full article
(This article belongs to the Special Issue Piezoelectric Materials, Devices and Integrated Systems)
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11 pages, 10403 KiB  
Article
Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array
by Xianglong Wang, Jiaming Su, Dongdong Chen, Di Li, Gaoliang Li and Yintang Yang
Micromachines 2023, 14(8), 1493; https://doi.org/10.3390/mi14081493 - 25 Jul 2023
Viewed by 1084
Abstract
In this research, an efficient thermal-stress coupling design method for a Chiplet-based system with a coaxial through silicon via (CTSV) array is developed by combining the support vector machine (SVM) model and particle swarm optimization algorithm with linear decreasing inertia weight (PSO-LDIW). The [...] Read more.
In this research, an efficient thermal-stress coupling design method for a Chiplet-based system with a coaxial through silicon via (CTSV) array is developed by combining the support vector machine (SVM) model and particle swarm optimization algorithm with linear decreasing inertia weight (PSO-LDIW). The complex and irregular relationship between the structural parameters and critical indexes is analyzed by finite element simulation. According to the simulation data, the SVM model is adopted to characterize the relationship between structural parameters and critical indexes of the CTSV array. Based on the desired critical indexes of the CTSV array, the multi-objective evaluation function is established. Afterwards, the structural parameters of the CTSV array are optimized through the PSO-LDIW algorithm. Finally, the effectiveness of the developed method is verified by the finite element simulation. The simulated peak temperature, peak stress of the Chiplet-based system, and peak stress of the copper column (306.16 K, 28.48 MPa, and 25.76 MPa) well agree with the desired targets (310 K, 30 MPa, and 25 MPa). Therefore, the developed thermal-stress coupling design method can effectively design CTSV arrays for manufacturing high-performance interconnect structures applied in Chiplet-based systems. Full article
(This article belongs to the Special Issue Piezoelectric Materials, Devices and Integrated Systems)
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