Special Issue "Micro-Manufacturing and Applications, Volume IV: Materials and High-Precision Micromachining"

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".

Deadline for manuscript submissions: 15 June 2023 | Viewed by 962

Special Issue Editor

Department MAE, College CDEPS, Brunel University, London UB8 3PH, UK
Interests: micro nano manufacturing; non-traditional manufacturing technologies; micro milling; micro EDM; nicro ECM; lazer machining; micro abrasive machining
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Special Issue Information

Dear Colleagues,

Micro-machining became fashionable more than 15 years ago as the need for micro parts became dominant on the consumer and military markets. In the beginning, a significant portion of micro parts were made of silicon, as one of the most well-known materials. The processing technologies also came from the semiconductor industry, and equipment and machines predominantly covered mostly the production of silicon-based parts. This material could not, however, meet the need for micro parts and products on the market. There was and there still is significant demand for non-silicon-based micro- and nanoproducts, as well as for the development of processing equipment and machines for non-silicon-based materials. It has thus become clear that the materials use in normal manufacturing are in most cases not applicable or suitable for the production of micro and nano parts. It has also become clear that the existing manufacturing technologies can to some extent be scaled down, but there are natural limits to the equipment and processes beyond which new technologies (processing windows) and new equipment need to be designed and adopted. In many cases, specific manufacturing processes are oriented toward only specific materials, and the production of specific parts (or features) is only possible with the use of certain technology.

The aim of this Special Issue is to publish papers devoted to materials and specific micro/nano-manufacturing technologies. Also welcome are papers devoted to designing materials with pre-defined properties (either for specific processes or specific use). It is anticipated that the need to design materials for specific needs will grow rapidly, and thus, establishing standards for micro/nano-machining is important; as such, papers focusing on establishing the natural boundaries of processes and/or determining their limits are very welcome.

Dr. Atanas Ivanov
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • micro manufacturing
  • high-precision micromachining
  • specific micro/nano-manufacturing technologies
  • materials design
  • micro/nano-machining

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Published Papers (2 papers)

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Research

Article
Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging
Micromachines 2023, 14(4), 838; https://doi.org/10.3390/mi14040838 - 12 Apr 2023
Viewed by 458
Abstract
The performance of rolling parameters and annealing processes on the microstructure and properties of Cu strip were studied by High Precision Rolling Mill, FIB, SEM, Strength Tester, and Resistivity Tester. The results show that with the increase of the reduction rate, coarse grains [...] Read more.
The performance of rolling parameters and annealing processes on the microstructure and properties of Cu strip were studied by High Precision Rolling Mill, FIB, SEM, Strength Tester, and Resistivity Tester. The results show that with the increase of the reduction rate, coarse grains in the bonding Cu strip are gradually broken and refined, and the grains are flattened when the reduction rate is 80%. The tensile strength increased from 248.0 MPa to 425.5 MPa, while the elongation decreased from 8.50% to 0.91%. The growth of lattice defects and grain boundary density results in an approximately linear increase in resistivity. With the increase of annealing temperature to 400 °C, the Cu strip recovers, and the strength decreased from 456.66 MPa to 220.36 MPa while the elongation rose from 1.09% to 24.73%. The tensile strength and elongation decreased to 192.2 MPa and 20.68%, respectively, when the annealing temperature was 550 °C. The trend of yield strength of the Cu strip was basically the same as that of tensile strength. The resistivity of the Cu strip decreased rapidly during a 200~300 °C annealing temperature, then the trend slowed, and the minimum resistivity was 3.60 × 10−8 Ω·m. The optimum tension range annealing was 6–8 g; less or more than that will affect the quality of the Cu strip. Full article
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Article
Single Layer Lift-Off of CSAR62 for Dense Nanostructured Patterns
Micromachines 2023, 14(4), 766; https://doi.org/10.3390/mi14040766 - 29 Mar 2023
Viewed by 382
Abstract
Lift-off processing is a common method of pattern transfer for different nanofabrication applications. With the emergence of chemically amplified and semi-amplified resist systems, the possibilities for pattern definition via electron beam lithography has been widened. We report a reliable and simple lift-off process [...] Read more.
Lift-off processing is a common method of pattern transfer for different nanofabrication applications. With the emergence of chemically amplified and semi-amplified resist systems, the possibilities for pattern definition via electron beam lithography has been widened. We report a reliable and simple lift-off process for dense nanostructured pattern in CSAR62. The pattern is defined in a single layer CSAR62 resist mask for gold nanostructures on silicon. The process offers a slimmed down pathway for pattern definition of dense nanostructures with varied feature size and an up to 10 nm thick gold layer. The resulting patterns from this process have been successfully used in metal assisted chemical etching applications. Full article
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