Editorial Board for section 'D1: Semiconductor Devices'

Please see the section webpage for more information on this section.

Please note that the order in which the Editors appear on this page is alphabetical, and follows the structure of the editorial board presented on the MDPI website under information for editors: editorial board responsibilities.

Members


Website
Section Board Member
Centre de Recherche sur l'Hetero-Epitaxie et ses Applications, 06560 Valbonne, France
Interests: optoelectronics; LEDs; quantum dots; epitaxy; semi-conductors
Special Issues, Collections and Topics in MDPI journals
RNANO Lab - Research Lab of Advanced, Composite, Nanomaterials & Nanotechnology, Department of Materials Science and Engineering, School of Chemical Engineering, National Technical University of Athens, GR-15780 Zographos Athens, Greece
Interests: polymers nanocomposites; carbon based materials; advanced composite materials; nanocomposites; nanoindentation; nanomechanics
Special Issues, Collections and Topics in MDPI journals

Website
Section Board Member
School of Advanced Materials Science and Engineering, Sungkyunkwan University, 2006 Seobu-ro, Jangan-gu, Gyeonggi-do, Suwon 16419, Republic of Korea
Interests: metal oxide; photoelectrochemical reaction; thin film transistor
Special Issues, Collections and Topics in MDPI journals

Website
Section Board Member
Division of Materials Science and Engineering, Hanyang University, Seoul 04763, Republic of Korea
Interests: semiconductor logic device; memory device; power device; display device; optoelectronic device; electronic nanomaterials; semiconductors; 2D nanodevice; nanowire FET; neuromorphic computing memristive device; resistive-switching device; ferroelectric FET; flexible device; advanced semiconductor and display devices; materials; process technology
Special Issues, Collections and Topics in MDPI journals
Department of Mechanical Systems Engineering, Graduate School of Engineering, Tohoku University, Sendai 980-8579, Miyagi, Japan
Interests: 3D and heterogeneous system integration; flexible hybrid electronics (FHE); flexible in-mold electronics; polymer science and technology; capillary self-assembly; directed self-assembly (DSA); microelectronic packaging including TSV, WLP, and micro-LED
Dr. Tino Hofmann
Website
Section Board Member
Department of Physics and Optical Science, University of North Carolina at Charlotte, Charlotte, NC 28223, USA
Interests: THz-IR-VUV ellipsometry; optical hall effect; III-V semiconductors; metamaterials; thin-film properties

Website
Section Board Member
Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA 19104, USA
Interests: nanoelectronics; nanophotonics; surface science; photovoltaics; condensed matter physics; scanning probe techniques; semiconductor opto-electronics
Special Issues, Collections and Topics in MDPI journals

Website
Section Board Member
School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
Interests: nanomaterials; semiconductor; electronics; optoelectronics
Special Issues, Collections and Topics in MDPI journals

Website
Section Board Member
Department of Electrical and Computer Engineering, Clemson University, Clemson, SC 29634, USA
Interests: III-Nitride MEMS; chemical sensors; biosensors; 2D materials; nanoelectronics
Special Issues, Collections and Topics in MDPI journals

Website
Section Board Member
School of Computer Science and Electronic Engineering, Bangor University, Bangor Gwynedd LL57 2DG, UK
Interests: organic electronics; sensors; SWCNTs; graphene; microelectronics
Special Issues, Collections and Topics in MDPI journals
Microsystems Engineering, Rochester Institute of Technology, Rochester, NY 14623, USA
Interests: semiconductors; nanomaterials; epitaxy; MOVPE; heterogeneous integration; optoelectronics; nanofabrication; metal-assisted chemical etching

Website
Section Board Member
1. Institute of Electronics, Microelectronics and Nanotechnology, MMicrowave and Semiconductor Department, University of Lille, 59650 Villeneuve d´Ascq, France
2. Department of Electrical Engineering and Computer Engineering, Université de Sherbrooke, Sherbrooke, QC J1K 2R1, Canada
Interests: GaN HEMT; RF power; RTD (Al(Ga)N/GaN)n; AlN RF power switch; diamond transistors; AlN MEMS actuators; devices based on WBGM; GaN sensors; power electronics

Website
Section Board Member
Department of Electronics, Carleton University, Ottawa, ON K1S 5B6, Canada
Interests: micro-fabrication and micro-electro-mechanical systems (MEMS); thin film processing materials and technologies; silicon and MEMS sensors; MEMS and sensor integration with CMOS signal conditioning circuitry; RF and microwave MEMS devices; infrared sensing and imaging; silicon photonic and plasmonic devices; amorphous semiconductor devices; micro-fluidic effects and devices

Website
Section Board Member
School of Electrical & Electronic Engineering, Nanyang Technological University, S1-B1a-22, 50 Nanyang Avenue, Singapore 639798, Singapore
Interests: carbon based materials; carbon nanotubes; 2D materials; vacuum arc technology; thin films
Special Issues, Collections and Topics in MDPI journals
Electronic Nanomaterials and Devices Group, National Technical University of Athens, 15780 Athens, Greece
Interests: gas sensors; biosensors; force sensors; nanoparticle networks; nanofabrication; metal oxides
Prof. Dr. Gunuk Wang
Website
Section Board Member
KU-KIST Graduate School of Converging Science & Technology, Korea University, Seoul 02841, Republic of Korea
Interests: molecular electronics; neuromorphic electronics; memristive electronic devices

Website
Section Board Member
Department of Mechanical Engineering, University of Colorado, 427 UCB, Boulder, CO 80309-0427, USA
Interests: flexible and stretchable electronics; soft machines; mechanics of nanomaterials; soft materials; and thin films
Prof. Dr. Eui-Hyeok Yang
Website
Section Board Member
Department of Mechanical Engineering, Stevens Institute of Technology, Castle Point on the Hudson, Hoboken, NJ 07030, USA
Interests: MEMS; microactuators; nanofabrication; graphene and other 2D materials; conjugated polymers; droplet microfluidics
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