Additive Manufacturing of Advanced Materials: Fabrication, Characterization, and Properties

A special issue of Metals (ISSN 2075-4701). This special issue belongs to the section "Additive Manufacturing".

Deadline for manuscript submissions: closed (31 August 2022) | Viewed by 1039

Special Issue Editors

Indian Institute of Technology (BHU), Varanasi, India
Interests: additive manufacturing; severe plastic deformation; deformation behavior; creep; superplasticity
Special Issues, Collections and Topics in MDPI journals
Department of Mechanical Engineering IIT, Indian Institute of Technology (BHU), Varanasi, India
Interests: additive manufacturing; materials joining; deformation behavior
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Additive manufacturing (AM) has evolved from a rapid prototyping technology to a fabrication method that can produce complex end-use parts for critical applications. The design freedom that AM technology offers can open doors for the fabrication of components that do not currently exist and can allow for design optimization that cannot be fabricated even with expensive machining processes. The need for the development of advanced materials with mechanical properties that are superior to existing ones is constant for several challenging applications. Research about this topic aims to explore unique strategies in the development of advanced materials via an additive manufacturing route.

Dr. Praveen Sathiyamoorthi
Dr. Manogna Karthik Gangaraju
Guest Editors

Manuscript Submission Information

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Keywords

  • Process parameter optimization
  • Alloy design for additive manufacturing 
  • High-entropy alloys by additive manufacturing
  • TRIP- and TWIP-based alloys by additive manufacturing
  • Precipitation-strengthened alloys by additive manufacturing
  • Room, cryogenic and high-temperature properties of additive parts
  • Creep and fatigue properties of additive parts

Published Papers

There is no accepted submissions to this special issue at this moment.
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