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New Trends in Sustainable Building Materials
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Special Issue "New Trends in Sustainable Building Materials"

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Construction and Building Materials".

Deadline for manuscript submissions: 10 March 2024 | Viewed by 1122

Special Issue Editor

Dr. Madalina Simona Baltatu

E-Mail Website
Guest Editor
Department of Technologies and Equipment for Materials Processing, Faculty of Materials Science and Engineering, Technical University Gheorghe Asachi of Iasi, 700050 Iasi, Romania
Interests: materials science; durability of materials in civil engineering; sustainable cementitious materials; metallic alloys; biomaterials; biodegradable alloys; biomaterials characterization; coatings and thin films
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Sustainability is one of the topics that frequently comes up while talking about the future of construction.  It is obvious that more needs to be done by the construction sector to safeguard the environment. Encouraging sustainability will benefit both present and future generations.

Reduced energy consumption and judicious material selection are more important than ever because of the inevitable rise in housing difficulties and the effects of climate change on the world. Eco-friendly building materials are those that can be easily recycled and do not hurt the environment during their creation, usage, or disposal. In the long run, using eco-friendly materials is really advantageous. Green home construction dramatically lowers carbon emissions and uses less energy, which leads to lower energy costs.

This Special Issue is for the colleagues who are doing immense and unstoppable work for this field, to present the latest trends and research regarding the performing sustainable building materials of our days. All advances in building materials is welcome to be published and shared. In this Special Issue, original research articles and reviews are welcome.

Dr. Madalina Simona Baltatu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • sustainable building materials
  • construction materials
  • smart solutions
  • waste management and utilization
  • environment efficiency
  • recycled materials
  • life cycle assessment
  • eco-friendly building materials

Published Papers (1 paper)

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Research

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Article
Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis
by
Siti Farahnabilah Muhd Amli
,
Mohd Arif Anuar Mohd Salleh
,
Mohd Sharizal Abdul Aziz
,
Hideyuki Yasuda
,
Kazuhiro Nogita
,
Mohd Mustafa Al Bakri Abdullah
,
Ovidiu Nemes
,
Andrei Victor Sandu
and
Petrica Vizureanu
Materials 2023, 16(12), 4360; https://doi.org/10.3390/ma16124360 - 13 Jun 2023
Viewed by 720
Abstract
The growth and formation of primary intermetallics formed in Sn-3.5Ag soldered on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish after multiple reflows were systematically investigated. Real-time synchrotron imaging was used to investigate the microstructure, focusing on the [...] Read more.
The growth and formation of primary intermetallics formed in Sn-3.5Ag soldered on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish after multiple reflows were systematically investigated. Real-time synchrotron imaging was used to investigate the microstructure, focusing on the in situ growth behavior of primary intermetallics during the solid–liquid–solid interactions. The high-speed shear test was conducted to observe the correlation of microstructure formation to the solder joint strength. Subsequently, the experimental results were correlated with the numerical Finite Element (FE) modeling using ANSYS software to investigate the effects of primary intermetallics on the reliability of solder joints. In the Sn-3.5Ag/Cu-OSP solder joint, the well-known Cu6Sn5 interfacial intermetallic compounds (IMCs) layer was observed in each reflow, where the thickness of the IMC layer increases with an increasing number of reflows due to the Cu diffusion from the substrate. Meanwhile, for the Sn-3.5Ag/ENIG solder joints, the Ni3Sn4 interfacial IMC layer was formed first, followed by the (Cu, Ni)6Sn5 IMC layer, where the formation was detected after five cycles of reflow. The results obtained from real-time imaging prove that the Ni layer from the ENIG surface finish possessed an effective barrier to suppress and control the Cu dissolution from the substrates, as there is no sizeable primary phase observed up to four cycles of reflow. Thus, this resulted in a thinner IMC layer and smaller primary intermetallics, producing a stronger solder joint for Sn-3.5Ag/ENIG even after the repeated reflow process relative to the Sn-3.5Ag/Cu-OSP joints. Full article
(This article belongs to the Special Issue New Trends in Sustainable Building Materials)
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