Special Issue "Advances in Smart Materials and Structures"
Deadline for manuscript submissions: closed (20 March 2023) | Viewed by 15607
Interests: smart materials; composite structures; mechanics; multiscale analysis; elasticity & viscoelasticity; nondestructive testing & evaluation
Interests: neutron diffraction; residual stress; metal and alloy; spray forming; dissimilar metals
Smart materials and structures are capable of active or passive changes in terms of shapes (geometries), properties, mechanical or electromagnetic responses, in reaction to an external stimulus, such as light, temperature, stress, moisture, pH, electric or magnetic fields. They have attracted increasing interest for their enhanced performance and efficiency over a wide range of industrial applications, especially in aerospace. These applications require novel engineering approaches and design philosophy in order to integrate the actions of sensors, actuators, and control circuit elements into a single system that can respond adaptively to the surroundings.
In this Special Issue, we focus on cutting-edge research and recent advances in smart materials and structures, by all means of theoretical, experimental, and numerical analysis. We encourage submissions of original research papers, short communications, as well as review articles. We hope that this Special Issue will contribute to disseminating the latest progress in this field, as well as stimulating the interest of its audiences to work in this important and vibrant area to promote and benefit the multidisciplinary scientific communities.
Potential topics for submissions include but are not limited to:
- Smart materials, such as shape memory alloys and polymers, piezoelectric, ferroelectric, electrorheological, magnetorheological materials, self-healing materials, multifunctional materials, as well as novel hierarchical materials;
- Morphing structures, such as adaptive structures, bioinspired materials and structures, active or passive structures, energy-harvesting systems, origami structures, deployable structures, pattern-driven structures, etc.;
- Smart materials or structures used as actuators, transducers, or sensors, covering signal processing methods, intelligent sensing and diagnosis, structural health monitoring, etc.;
- Performance measurement and control mechanisms, structural mechanics, multiscale (micro-, meso- and/or macro-scale) characterization and analysis through destructive or non-destructive testing and evaluation techniques;
- Advanced manufacturing and evaluation of novel materials and structures.
Prof. Dr. Bing Wang
Dr. Tung Lik Lee
Dr. Yang Qin
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- intelligent sensing and diagnosis
- structural health monitoring
- multiscale analysis
- elasticity and viscoelasticity
- finite element analysis