Special Issue "Abrasive Machining of Semiconductor Materials: Equipment, Materials, and Processes"
Deadline for manuscript submissions: 20 January 2024 | Viewed by 435
Semiconductor materials play crucial roles in numerous engineering applications that range from electronics and photonics to renewable energy and biotechnology etc. Achieving the desired levels of dimensional accuracy, geometric precision, and surface quality in the semiconductor manufacturing industry is essential for the successful development of cutting-edge devices and systems. This Special Issue concentrates on precise abrasive machining of semiconductor materials, with a specific emphasis on exploring advancements in equipment, materials, and processes. It serves as a platform via which to explore the latest advances, challenges, and innovations in the abrasive machining of semiconductor materials and aims to bring together academic researchers, scientists, industry engineers and experts to share their insights, exchange knowledge, and present novel approaches in the field.
The research articles featured in this Issue will cover a broad spectrum of topics, including grinding, lapping, polishing, and other related processes such as chemical mechanical planarization (CMP), edge profiling, and wire-sawing, etc., with widespread use in the semiconductor manufacturing industry. Authors will delve into the intricacies of 1) innovative abrasive machining equipment, tool design and development, 2) novel abrasive materials and other related consumables, 3) abrasive machining process analysis, simulation and optimization. Furthermore, the Issue will highlight the application of abrasive machining for extremely hard-to-machine semiconductor materials such as sapphire and silicon carbide.
This Special Issue aligns perfectly with the scope of Machines as it presents research on equipment design, advanced materials, and process optimization in the field of semiconductor manufacturing. By showcasing the application of abrasive machining in the semiconductor industry, this Special Issue will contribute directly to this publications; 'Machines' objective of disseminating knowledge on machine tools, manufacturing processes, and related technologies. We anticipate that this Special Issue will contribute significantly to advancing the understanding and implementation of abrasive machining in semiconductor materials. It is our hope that the research presented herein will inspire new ideas, foster collaborations, and pave the way for further advancements in this rapidly evolving field.
Dr. Zhichao Li
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Machines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.