Selected Papers From the 4th International Conference on Microelectronic Devices and Technologies (MicDAT’ 2022)

A special issue of Journal of Low Power Electronics and Applications (ISSN 2079-9268).

Deadline for manuscript submissions: closed (1 August 2022) | Viewed by 2633

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International Frequency Sensor Association (IFSA), 08860 Castelldefels, Spain
Interests: smart sensors; optical sensors; frequency measurements
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Special Issue Information

Dear Colleagues,

This Special Issue contains extended papers from the 4th International Conference on Microelectronic Devices and Technologies (MicDAT' 2022), 15–17 June 2022, Corfu, Greece (https://micdat-conference.com)

The aim of the MicDAT series of conference is to provide an annual world forum for the presentation and discussion of recent advances in microelectronics and bring together leading international researchers, engineers and practitioners interested on any microelectronics-related technologies. Featuring strong participation of industry and academia, the MicDAT' 2022 conference will provide an excellent opportunity to exchange ideas and present the latest advancements in these areas. The conference is coordinated with the IFSA series of conferences, which deals with physics and engineering.

The event is intended to create awareness of the huge potential of modern microelectronic technologies and to improve understanding on the recent challenges in a wide range of applications. The many different technological bases for the fabrication of microelectronic devices, SoC, SiP, MEMS and NEMS will be outlined in this Special Issue. Particular attention will be given to low-power electronics.

Dr. Sergey Y. Yurish
Guest Editor

Manuscript Submission Information

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Published Papers (1 paper)

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Research

18 pages, 4283 KiB  
Article
Electromigration-Aware Architecture for Modern Microprocessors
by Freddy Gabbay and Avi Mendelson
J. Low Power Electron. Appl. 2023, 13(1), 7; https://doi.org/10.3390/jlpea13010007 - 11 Jan 2023
Cited by 1 | Viewed by 2104
Abstract
Reliability is a fundamental requirement in microprocessors that guarantees correct execution over their lifetimes. The reliability-related design rules depend on the process technology and device operating conditions. To meet reliability requirements, advanced process nodes impose challenging design rules, which place a major burden [...] Read more.
Reliability is a fundamental requirement in microprocessors that guarantees correct execution over their lifetimes. The reliability-related design rules depend on the process technology and device operating conditions. To meet reliability requirements, advanced process nodes impose challenging design rules, which place a major burden on the VLSI implementation flow because they impose severe physical constraints. This paper focuses on electromigration (EM), one of the critical factors affecting semiconductor reliability. EM is the aging process of on-die wires in integrated circuits (ICs). Traditionally, EM issues have been handled at the physical design level, which enforces reliability rules using worst-case scenario analysis to detect and solve violations. In this paper, we offer solutions that exploit architectural characteristics to reduce EM impact. The use of architectural methods can simplify EM solutions, and such methods can be incorporated with standard physical-design-based solutions to enhance current methods. Our comprehensive physical simulation results show that, with minimal area, power, and performance overhead, the proposed solution can relax EM design efforts and significantly extend a microprocessor’s lifetime. Full article
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