Recent Advances in Designing Hydrogels for Flexible Electronics and Devices
A special issue of Gels (ISSN 2310-2861). This special issue belongs to the section "Gel Processing and Engineering".
Deadline for manuscript submissions: closed (15 September 2023) | Viewed by 18762
Special Issue Editor
Interests: stretchable electronics; self-healing electronics; peripheral neural interface; functional nanomaterials; bio-integrated electronic system
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
We are writing to introduce a Special Issue, titled “Recent Advances in Designing Hydrogels for Flexible Electronics and Devices”. Soft, flexible/stretchable electronic devices have attracted extensive attention owing to their tremendous potential relating to the Internet of Things, human–machine interfaces, and even wearable/implantable healthcare applications. Representative approaches to the realization of the soft, flexible, bio-integrated electronics on a more practical level are divided into several methods: i) enabling the brittle inorganic conducting/insulating/semiconducting materials to be flexible and even stretchable using strategies for a rigid-island active layer connected to wavy interconnects and a neutral mechanical plane, ii) integrating commercially available chips such as central processing units, memory modules, batteries, and wireless communication parts with stretchable conductors supported on elastic substrates, and iii) making functional materials intrinsically stretchable and autonomously self-healable using nano-/micro-hydrogels/elastomers in dynamically crosslinked polymer matrixes. In this Special Issue, we will cover various approaches to the synthesis of soft functional materials for flexible/stretchable electronic devices. We invite researchers who are working on deformable electronics, ranging from stretchable material synthesis and its device fabrication, to process and system integration, to submit their high-quality manuscript for publication in this Special Issue.
Prof. Dr. Donghee Son
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Gels is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- stretchable and tough hydrogels
- self-healing hydrogels
- flexible and stretchable materials
- stretchable bio-integrated electronic materials and devices
- implantable biomaterials and interfaces
- functional soft composites and their applications to deformable electrodes or sensors