Product Design and Development Using Computational and Numerical Modeling

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Computer Science & Engineering".

Deadline for manuscript submissions: closed (15 June 2023) | Viewed by 3763

Special Issue Editors


E-Mail Website
Guest Editor

E-Mail Website
Guest Editor
Institute for Communications (ICS), 5G&6G Innovation Centre (5G&6GIC), University of Surrey, Guildford GU2 7XH, UK
Interests: IP networking protocols and technologies; satellite communications and networking; internet and teletraffic engineering; network security; mobile and wireless communications; mobile operating systems
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Department of Electrical and Information Engineering, Hunan University of Technology, Zhuzhou 412007, China
Interests: smart grid; electric engineering; smart energy
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues, 

Emerging technologies such as artificial intelligence (AI), augmented/virtual/mixed reality (AR/VR/MR), and cloud computing have the potential to drastically change the activities, output, and performance of product design and development (PDD) in the early phases. The majority of current applied new technology research is concentrated on the PDD and detailed design phases. They will have an impact on the front end of PDD in terms of understanding user needs, conceptual design, and the construction of systems architecture. 

In the design and implementation of products, PDD is inextricably linked. Engineering design is frequently a significant component of product development innovation, yet intriguing solutions that are prohibitively expensive or difficult to construct may never see the light of day. PDD advancement tends to minimize obstacles to implementation and expand design freedom, but it may also impose unique design constraints. As a result, new design methodologies and tools are required to assist engineers in navigating the unique design space formed by advanced manufacturing. The design of multifunctional, multimaterial, multiphysics, and/or multiscale parts and systems is one example of how advanced manufacturing opens up new opportunities. These designs must take into account how materials change during the manufacturing process, as well as manufacturing-induced flaws.

This Special Issue focuses on cutting-edge concepts in PDD. It also includes virtual simulation and reverse engineering, additive manufacturing, product manufacturing, numerical simulation, and computational modeling for machining mechanisms. Advanced manufacturing methods are in greater demand in a variety of sectors, from biomedical to aerospace. Modeling and mechanistic understanding of any physical phenomenon are the ways to create, hybridize, and improve manufacturing processes that can do more than what is currently possible.

This Special Issue aims to share the latest research, theories, and practices in product design and manufacturing technology in order to improve industrial performance. It will focus on how traditional and more sophisticated modeling methods can work together and how virtual manufacturing processes can be a source of new information.

Potential topics include but are not limited to:

  • Product design and development for circular business models;
  • Design for manufacturable hollow structures, cellular structures, multiscale structures, multimaterial structures, and composite structures;
  • Modeling, simulation, and control of manufacturing system;
  • Design optimization methods such as topology optimization, size optimization, and shape optimization to support advanced manufacturing;
  • Design for heterogeneous materials systems using hybrid manufacturing;
  • Sustainable product design and development in small and medium-sized enterprises (SMEs);
  • Sustainability in early product design and development;
  • Democratization, fairness, inclusion, bias, and ethics in emerging PDD technologies and methods;
  • Security, privacy, and intellectual property concerns in PDD.

Dr. Kevin Wong
Prof. Dr. Zhili Sun
Dr. Shengqing Li
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • product design and development
  • PDD
  • computational modeling
  • numerical modeling
  • artificial intelligence
  • early product design and development

Published Papers (2 papers)

Order results
Result details
Select all
Export citation of selected articles as:

Research

13 pages, 2534 KiB  
Article
Application of Numerical Simulation Technology in New Intelligent Reinforcing Method of Shield Tunnel End in Seaside Environment
by Hui Zeng, Tongfei Liu and Jun Hu
Electronics 2023, 12(6), 1361; https://doi.org/10.3390/electronics12061361 - 13 Mar 2023
Cited by 1 | Viewed by 1333
Abstract
The instability of the soil at the shield end is an important safety hazard in shield tunnel construction. In loose and weak strata, the risk of instability and damage is higher, and the loss is greater. In this paper, the instability and failure [...] Read more.
The instability of the soil at the shield end is an important safety hazard in shield tunnel construction. In loose and weak strata, the risk of instability and damage is higher, and the loss is greater. In this paper, the instability and failure of the end soil in loose and weak strata are studied. To ensure the smooth start and arrival of the shield and avoid engineering accidents such as end soil instability, surface subsidence, landslides, etc., during the construction process, this paper summarizes the commonly used reinforcement technology and characteristics of the shield in and out of the tunnel. Through numerical simulation, the influence of the thickness of the added solid on the formation and diaphragm wall is analyzed. It is found that the reinforcement effect increases with the increase in thickness of the added solid, but the change rate becomes smaller and smaller. The indoor triaxial test is used to find out the physical and mechanical properties of loose sand and soft clay. The biaxial compression numerical model is built with PFC2D (Particle Flow Code 2D PFC 6.0), and the wall constraint type is improved. With the help of the PFC biaxial test, the influence of model parameters on the macroscopic properties of the simulated material was analyzed. The research has certain reference values for the actual construction of the project. Full article
Show Figures

Figure 1

13 pages, 2893 KiB  
Article
A Measurement Compensation Method for Electrical Capacitance Tomography Sensors with Inhomogeneous Electrode Parameters
by Yaohong Tang, Weiqing Lin, Shungen Xiao, Kaihao Tang and Xiufang Lin
Electronics 2022, 11(18), 2957; https://doi.org/10.3390/electronics11182957 - 18 Sep 2022
Cited by 2 | Viewed by 1417
Abstract
An electrical capacitance tomography (ECT) sensor is an array capacitive sensor that is sensitive to the medium of the measured object and can be widely used in oil, natural gas, machinery and other industrial fields to solve the problem of multiphase fluid object [...] Read more.
An electrical capacitance tomography (ECT) sensor is an array capacitive sensor that is sensitive to the medium of the measured object and can be widely used in oil, natural gas, machinery and other industrial fields to solve the problem of multiphase fluid object parameter detection in industrial processes. However, ECT sensor uniformity defects need to be addressed. Aiming at the problem that the non-uniform electrode spacing angle affects the characteristics of the measured value of the actual ECT sensor, a method for compensating the measured value of the ECT sensor based on the assumption that the geometric factor is invariant is proposed. The simulated measurement value in the case of the tube and the measurement value of the actual sensor in the case of an empty tube and a full tube are to compensate the measurement value of the actual ECT. Experiments show that, without compensation, non-ideal sensor monitoring has large error, and, after compensation, it has a good effect and can be expected to perform satisfactorily in practical use. Full article
Show Figures

Figure 1

Back to TopTop