Special Issue "RF/MM-Wave/Sub-THz Integrated Circuits and Packaging Technologies for 6G"

Dear Colleagues,

As the presently allocated spectrum is being exhausted, the wireless industry is rapidly moving towards 5G systems, with carrier frequencies ranging from sub-6-GHz to 86 GHz. For the very same reason, research is now considering 6G systems with carrier frequencies between 7-24 GHz (FR3) and 100-300 GHz, due to their potential for high-speed wireless communication links with capacities well above 100 Gb/s. The superior capacity of 6G over its predecessor (5G) is primarily owing to the vast spectrum that is potentially available, and because the short wavelengths permit the occurrence of compact arrays that have many elements, thus supporting many simultaneous independent signal beams; these are known as massive spatial multiplexing, or massive MIMO.

The success of 5G, 6G, and the next generation of communication systems in general depends on the evolution of system and network design architectures, as well as the development of IC design techniques and packaging technologies. Since this area of research is relatively new and fertile, we invite you to contribute to this Special Issue of Electronics on “RF/mm-wave/Sub-THz Integrated Circuits and Packaging Technologies for 6G”, with your high-quality original research articles and reviews. We welcome contributions that attend to  research areas that may include (but are not limited to) the following:

• ICs and systems in Silicon, SiGe, and III-V for 6G FR3 band (7-24 GHz).
• ICs, systems, and modules for mm-wave/sub-THz 6G (100-300 GHz).
• Packaging and module technologies for mm-wave/sub-THz broadband receivers and transmitters, reliability considerations, and thermal handling.
• On-chip antennas, antennas-in-package, and heterogeneous integration.
• Review Papers: articles summarizing the state-of-the-art (or advances) in IC-design, module-design, and packaging for 6G-FR3 and mm-wave/sub-THz 6G. Potential authors are encouraged to contact the editors to discuss the topic of their paper before submission.

I look forward to receiving your contributions.

Dr. Amirreza Alizadeh
Guest Editor

Manuscript Submission Information

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• antenna-in-package
• CMOS/GaAs/GaN/InP/SiGe integrated circuits
• high-frequency module design
• high-frequency packaging
• heterogeneous integration
• on-chip antennas
• mm-wave, sub-THz, 6G