Special Issue "RF/MM-Wave/Sub-THz Integrated Circuits and Packaging Technologies for 6G"

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Circuit and Signal Processing".

Deadline for manuscript submissions: 15 February 2024 | Viewed by 58

Special Issue Editor

Dr. Amirreza Alizadeh
E-Mail Website
Guest Editor
1. Keysight Technologies, Santa Rosa, CA 95403, USA
2. Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, CA 93106, USA
Interests: RF/mm-wave integrated circuit design; mixed-signal and analog circuits and systems; high-frequency planar antennas and packaging

Special Issue Information

Dear Colleagues,

As the presently allocated spectrum is being exhausted, the wireless industry is rapidly moving towards 5G systems, with carrier frequencies ranging from sub-6-GHz to 86 GHz. For the very same reason, research is now considering 6G systems with carrier frequencies between 7-24 GHz (FR3) and 100-300 GHz, due to their potential for high-speed wireless communication links with capacities well above 100 Gb/s. The superior capacity of 6G over its predecessor (5G) is primarily owing to the vast spectrum that is potentially available, and because the short wavelengths permit the occurrence of compact arrays that have many elements, thus supporting many simultaneous independent signal beams; these are known as massive spatial multiplexing, or massive MIMO.

The success of 5G, 6G, and the next generation of communication systems in general depends on the evolution of system and network design architectures, as well as the development of IC design techniques and packaging technologies. Since this area of research is relatively new and fertile, we invite you to contribute to this Special Issue of Electronics on “RF/mm-wave/Sub-THz Integrated Circuits and Packaging Technologies for 6G”, with your high-quality original research articles and reviews. We welcome contributions that attend to  research areas that may include (but are not limited to) the following:

  • ICs and systems in Silicon, SiGe, and III-V for 6G FR3 band (7-24 GHz).
  • ICs, systems, and modules for mm-wave/sub-THz 6G (100-300 GHz).
  • Packaging and module technologies for mm-wave/sub-THz broadband receivers and transmitters, reliability considerations, and thermal handling.
  • On-chip antennas, antennas-in-package, and heterogeneous integration.
  • Review Papers: articles summarizing the state-of-the-art (or advances) in IC-design, module-design, and packaging for 6G-FR3 and mm-wave/sub-THz 6G. Potential authors are encouraged to contact the editors to discuss the topic of their paper before submission.

I look forward to receiving your contributions.

Dr. Amirreza Alizadeh
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2200 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • antenna-in-package
  • CMOS/GaAs/GaN/InP/SiGe integrated circuits
  • high-frequency module design
  • high-frequency packaging
  • heterogeneous integration
  • on-chip antennas
  • mm-wave, sub-THz, 6G

Published Papers

This special issue is now open for submission.
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