Special Issue "GaN-Based Materials and Their Devices"

A special issue of Crystals (ISSN 2073-4352). This special issue belongs to the section "Materials for Energy Applications".

Deadline for manuscript submissions: 31 December 2023 | Viewed by 858

Special Issue Editors

Department of Electrical and Computer Engineering, University of California-Santa Barbara, Santa Barbara, CA 93106, USA
Interests: GaN; semiconductors; electronics
School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China
Interests: GaN; semiconductors; electron devices and related ciruits

Special Issue Information

Dear Colleagues,

III-nitride (GaN, AlN, InN, BN) heterostructures and their alloys are at the forefront in the effort to fulfil the needs of next-generation power conversion technology and communication systems, enabling a compact, affordable and energy-efficient future for all humanity. In addition to its widespread use in state-of-the-art light emitting diodes (LEDs) and laser diodes (LDs), this semiconductor family is leading the way by replacing conventional semiconductors in high-power and RF electronics, and has more recently shown immense promise for use in solar cells and thermoelectric generators, novel spintronic and nuclear detection devices, plasmonics, and quantum computing systems. Some main reasons for this include: (a) tunability across a wide bandgap range, (b) polarization fields enabling multiple applications within the same material, and (c) well-established growth techniques.

Moreover, the exceptional fundamental properties of electrons in III-nitrides have enabled the widespread use of these materials for reliable high-power and high-frequency electronics. This is an exciting time for GaN-based materials and devices in the research setting, as well as the push to strategize the propagation of this semiconductor into industry and commercial applications.

This Special Issue seeks to present cutting-edge works spanning novel physics, materials development and device applications utilizing GaN (III-nitrides), their heterostructures and alloys. This Special Issue will also cover works relating to circuit- and system-level design based on GaN. We will first answer the question, “why GaN?”, and then move onto “how GaN?” Since this is an important time for this materials system to strategically make inroads for commercial applications, this Special Issue also gives importance to works related to the plan for GaN to be integrated with other materials systems and existing facilities for scaled production.

Dr. Athith Krishna
Prof. Dr. Dunjun Chen
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Crystals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • semiconductors
  • III-nitrides
  • GaN
  • wide-bandgap semiconductors
  • power electronics
  • LEDs
  • laser diodes
  • novel nitrides
  • HEMTs
  • epitaxy
  • MOCVD
  • MBE

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Research

10 pages, 3800 KiB  
Article
Temperature-Dependent Optical Behaviors and Demonstration of Carrier Localization in Polar and Semipolar AlGaN Multiple Quantum Wells
Crystals 2023, 13(7), 1076; https://doi.org/10.3390/cryst13071076 - 08 Jul 2023
Viewed by 659
Abstract
Semipolar AlGaN multiple quantum wells (MQWs) have unique advantages in deep ultraviolet light emitters due to the weak Quantum-Confined Stark Effect. However, their applications are hampered by the poor crystalline quality of semipolar AlGaN thin films. Different treatments were developed to improve the [...] Read more.
Semipolar AlGaN multiple quantum wells (MQWs) have unique advantages in deep ultraviolet light emitters due to the weak Quantum-Confined Stark Effect. However, their applications are hampered by the poor crystalline quality of semipolar AlGaN thin films. Different treatments were developed to improve the crystal quality of semipolar AlGaN, including a multistep in situ thermal annealing technique proposed by our group. In this work, temperature-dependent and time-resolved photoluminescence characterizations were performed to reveal the carrier localization in the MQW region. The degree of carrier localization in semipolar AlGaN MQWs grown on top of the in situ-annealed AlN is similar to that of conventional ex situ face-to-face annealing, both of which are significantly stronger than that of the c-plane counterpart. Moreover, MQWs on in situ-annealed AlN show drastically reduced dislocation densities, demonstrating its great potential for the future development of high-efficiency optoelectronic devices. Full article
(This article belongs to the Special Issue GaN-Based Materials and Their Devices)
Show Figures

Figure 1

Back to TopTop