Wide-Bandgap Semiconductor Materials, Devices and Systems

A special issue of Crystals (ISSN 2073-4352). This special issue belongs to the section "Materials for Energy Applications".

Deadline for manuscript submissions: closed (11 January 2024) | Viewed by 12082

Special Issue Editors


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Guest Editor
School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China
Interests: wide bandgap semiconductor device and system integration; cmos; novel ultra-high density memory and electronic ceramics

E-Mail Website
Guest Editor
School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China
Interests: GaN devices and power system; GaN RF devices and the PA module

Special Issue Information

Dear Colleagues,

We are glad to run a Special Issue with Crystals. We invite you to share your impressive and distinctive research works with us, and will truly appreciate your contribution.

This Special Issue is titled ‘Wide-Bandgap Semiconductor Materials, Devices and Systems’, and the materials include but are not limited to GaN, Ga2O3, SiC, ZnO, AlN, and diamond. More specifically, the scope of this Issue covers five common key technological research topics for the study of material properties, device performance and system design of wide-bandgap semiconductors. The topics of interest are as follows: Material epitaxy (epitaxial structure design, advanced epitaxial methods, material and electrical characterization, etc.); microelectronic fabrication processes (etching process research, ohmic contact improvement, breakdown voltage enhancement, gate dielectric engineering, etc.); novel device design and application (monolithic integrated devices, vertical devices, multi-gate devices, sensors, ferroelectric devices, etc.); semiconductor device physics (device reliability, failure analysis, modeling, etc.); and advanced system integration (power supply systems, power amplifier architecture, circuit efficiency improvement, advanced packaging, etc.). The above topics are just for your reference. Any related topics not mentioned above are also acceptable for this Special Issue.

We would be grateful if we received your manuscripts before 30 June 2023, which will leave sufficient time for the review stage. The peer review committee will carefully consider each manuscript and reply to you as soon as possible. If you have any questions, please do not hesitate to contact us.

Prof. Dr. Hongyu Yu
Prof. Dr. Qing Wang
Guest Editors

Manuscript Submission Information

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Crystals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • wide bandgap semiconductor
  • materials growth and applications
  • advanced process technology
  • group III-V power electronics and RF devices
  • novel materials and devices
  • device design and modeling
  • semiconductor device physics
  • RF devices and power electronics reliability
  • RF circuit, system and module
  • advanced packaging and packaging trends

Published Papers (8 papers)

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Research

14 pages, 12717 KiB  
Article
Analysis of the Effect of Copper Doping on the Optoelectronic Properties of Indium Oxide Thin Films and the Thermoelectric Properties of an In2O3/Pt Thermocouple
by Yantao Liu, Tao Lin, Rong Huang, Jiahao Shi and Sui Chen
Crystals 2024, 14(1), 78; https://doi.org/10.3390/cryst14010078 - 13 Jan 2024
Viewed by 914
Abstract
The detection and real-time monitoring of temperature parameters are important, and indium oxide-based thin film thermocouples can be integrated on the surface of heaters because they operate normally under harsh conditions and provide accurate online temperature monitoring. The higher stability and appropriate optical [...] Read more.
The detection and real-time monitoring of temperature parameters are important, and indium oxide-based thin film thermocouples can be integrated on the surface of heaters because they operate normally under harsh conditions and provide accurate online temperature monitoring. The higher stability and appropriate optical and electrical properties of In2O3 make it very suitable as an electrode material for thermocouple sensors. This work demonstrates that copper doping can alter the optical and electrical properties of In2O3 films and regulate the output performance of thermocouples. Copper-doped In2O3 thin films were prepared using the magnetron co-sputtering method. The doping concentration of Cu was controlled using direct current (DC) power. An In2O3/Pt thermocouple sensor was prepared, and the optoelectronic and thermocouple properties were adjusted by changing the copper doping content. The thickness valve of the thin film sample was 300 nm. The results of the X-ray diffraction suggested that the structure of the doped In2O3 thin films was cubic. The results of the energy-dispersive X-ray analysis revealed that Cu was doped into the In2O3 thin films. All deposited films were n-type semiconductor materials according to Hall effect testing. The 4.09 at% Cu-doped thin films possessed the highest resistivity (30.2 × 10−3 Ω·cm), a larger carrier concentration (3.72 × 1020 cm−3), and the lowest carrier mobility (0.56 cm2V−1s−1). The optical band gap decreased from 3.76 to 2.71 eV with an increase in the doping concentration, and the transmittance of the film significantly reduced. When the DC power was increased, the variation range of Seebeck coefficient for the In2O3/Pt thermocouple was 152.1–170.5 μV/°C, and the range of thermal output value was 91.4–102.4 mV. Full article
(This article belongs to the Special Issue Wide-Bandgap Semiconductor Materials, Devices and Systems)
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13 pages, 3248 KiB  
Article
NiO/Ga2O3 Vertical Rectifiers of 7 kV and 1 mm2 with 5.5 A Forward Conduction Current
by Jian-Sian Li, Hsiao-Hsuan Wan, Chao-Ching Chiang, Timothy Jinsoo Yoo, Fan Ren, Honggyu Kim and Stephen J. Pearton
Crystals 2023, 13(12), 1624; https://doi.org/10.3390/cryst13121624 - 23 Nov 2023
Viewed by 1019
Abstract
In this study, we present the fabrication and characterization of vertically oriented NiO/β polymorph n-Ga2O3/n+ Ga2O3 heterojunction rectifiers featuring a substantial area of 1 mm2. A dual-layer SiNX/SiO2 dielectric field plate [...] Read more.
In this study, we present the fabrication and characterization of vertically oriented NiO/β polymorph n-Ga2O3/n+ Ga2O3 heterojunction rectifiers featuring a substantial area of 1 mm2. A dual-layer SiNX/SiO2 dielectric field plate edge termination was employed to increase the breakdown voltage (VB). These heterojunction rectifiers exhibit remarkable simultaneous achievement of high breakdown voltage and substantial conducting currents. In particular, the devices manifest VB of 7 kV when employing a 15 µm thick drift layer doping concentration of 8.8 × 1015 cm−3, concurrently demonstrating a forward current of 5.5 A. The thick drift layer is crucial in obtaining high VB since similar devices fabricated on 10 µm thick epilayers had breakdown voltages in the range of 3.6–4.0 kV. Reference devices fabricated on the 15 µm drift layers had VB of 5 kV. The breakdown is still due to leakage current from tunneling and thermionic emission and not from avalanche breakdown. An evaluation of the power figure-of-merit, represented by VB2/RON, reveals a value of 9.2 GW·cm−2, where RON denotes the on-state resistance, measuring 5.4 mΩ·cm2. The Coff was 4 nF/cm2, leading to an RON × Coff of 34 ps and FCO of 29 GHz. The turn-on voltage for these rectifiers was ~2 V. This exceptional performance surpasses the theoretical unipolar one-dimensional (1D) limit of both SiC and GaN, underscoring the potential of β-Ga2O3 for forthcoming generations of high-power rectification devices. Full article
(This article belongs to the Special Issue Wide-Bandgap Semiconductor Materials, Devices and Systems)
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9 pages, 3672 KiB  
Article
Hexagonal Nanocrystal Growth of Mg or Zn from Incorporation in GaN Powders Obtained through Pyrolysis of a Viscous Complex Compound and Its Nitridation
by Erick Gastellóu, Rafael García, Ana M. Herrera, Antonio Ramos, Godofredo García, Gustavo A. Hirata, José A. Luna, Roberto C. Carrillo, Jorge A. Rodríguez, Mario Robles and Yani D. Ramírez
Crystals 2023, 13(10), 1421; https://doi.org/10.3390/cryst13101421 - 25 Sep 2023
Viewed by 623
Abstract
Hexagonal nanocrystals were obtained from Zn-doped GaN powders and Mg-doped GaN powders, which were synthesized via pyrolysis of a viscous complex compound, followed by its nitridation. XRD showed well-defined peaks for hexagonal GaN with an average crystal size of 21.3 nm. Scanning electron [...] Read more.
Hexagonal nanocrystals were obtained from Zn-doped GaN powders and Mg-doped GaN powders, which were synthesized via pyrolysis of a viscous complex compound, followed by its nitridation. XRD showed well-defined peaks for hexagonal GaN with an average crystal size of 21.3 nm. Scanning electron microscopy showed an amorphous and porous appearance in surface morphology, which could be related to the combustion process. Energy-dispersive spectroscopy characterization showed contributions of gallium, nitrogen, and small traces of Zn and Mg in the GaN samples. TEM showed the presence of well-defined hexagonal nanocrystals with an area of 75.9 nm2 for the Zn-doped GaN powders and an area of 67.7 nm2 for the Mg-doped GaN powders. The photoluminescence spectra showed an emission energy of 2.8 eV (431.5 nm) for the Zn-doped GaN powders, while the Mg-doped GaN powders showed energies in the range from 2.7 eV to 2.8 eV (460.3 nm–443.9 nm). The Raman scattering showed spectra where the vibration modes A1(TO), E1(TO), and E2(High) could be observed, which are characteristic of hexagonal GaN. Full article
(This article belongs to the Special Issue Wide-Bandgap Semiconductor Materials, Devices and Systems)
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11 pages, 1812 KiB  
Article
A Fast Recovery SiC TED MOS MOSFET with Schottky Barrier Diode (SBD)
by Hongyu Cheng, Wenmao Li, Peiran Wang, Jianguo Chen, Qing Wang and Hongyu Yu
Crystals 2023, 13(4), 650; https://doi.org/10.3390/cryst13040650 - 10 Apr 2023
Viewed by 1771
Abstract
Achieving low conduction loss and good channel mobility is crucial for SiC MOSFETs. However, basic planar SiC MOSFETs provide challenges due to their high density of interface traps and significant gate-to-drain capacitance. In order to enhance the reverse recovery property of the device, [...] Read more.
Achieving low conduction loss and good channel mobility is crucial for SiC MOSFETs. However, basic planar SiC MOSFETs provide challenges due to their high density of interface traps and significant gate-to-drain capacitance. In order to enhance the reverse recovery property of the device, a Schottky barrier diode (SBD) was added to the source contact area, the top of the current spreading region, of a trench-etched double-diffused SiC MOS (TED MOS). Two types of SBD structures were optimized to improve the electrical properties using 3D simulation software, “TCAD Silvaco”. During reverse recovery simulation, the carriers of the device were withdrawn from the SBD, indicating that the new design was effective. It also showed that the recovery properties of the new design depended on temperature, carrier lifetime, and the work functions of metals. All the new designs were evaluated in various circumstances to determine the trend. Ultimately, in high-speed switching circuits, the SiC TED MOS with SBD structure efficiently boosted switching speed, while reducing switching loss. Full article
(This article belongs to the Special Issue Wide-Bandgap Semiconductor Materials, Devices and Systems)
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10 pages, 3095 KiB  
Article
Pressure Sensing of Symmetric Defect Photonic Crystals Composed of Superconductor and Semiconductor in Low-Temperature Environment
by Haiyang Hu, Xiaoling Chen, Miaomiao Zhao, Liyan Wang, Ming Fang and Dong Zhao
Crystals 2023, 13(3), 471; https://doi.org/10.3390/cryst13030471 - 09 Mar 2023
Viewed by 958
Abstract
We theoretically investigate the defect mode transmittance of light waves in superconductor–semiconductor photonic crystals and its pressure-sensing dependence. The photonic crystal is composed of alternating superconducting and semiconducting slabs and a defect locates at the center of this structure. Two trapezoid waveguides are [...] Read more.
We theoretically investigate the defect mode transmittance of light waves in superconductor–semiconductor photonic crystals and its pressure-sensing dependence. The photonic crystal is composed of alternating superconducting and semiconducting slabs and a defect locates at the center of this structure. Two trapezoid waveguides are fixed at both sides of the crystal, which induces the hydrostatic pressure applied and beams transmitted simultaneously. The resonant wavelength variation in the defect mode is directly proportional to the pressure applied on the system in the near-IR region, which can be utilized for linear pressure sensors in the cryogenic environment. Pressure sensitivity reaches a high value of 2.6 nm/GPa, which is higher than that in the study based on the reflection spectra. The sensitivity coefficient may be modulated by the environment temperature as well. This study has potential regarding pressure-light-wave sensors. Full article
(This article belongs to the Special Issue Wide-Bandgap Semiconductor Materials, Devices and Systems)
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10 pages, 2688 KiB  
Article
Temperature Sensing Based on Defect Mode of One-Dimensional Superconductor-Semiconductor Photonic Crystals
by Huisheng Wei, Xiaoling Chen, Dong Zhao, Miaomiao Zhao, Yang Wang and Pu Zhang
Crystals 2023, 13(2), 302; https://doi.org/10.3390/cryst13020302 - 12 Feb 2023
Cited by 5 | Viewed by 1783
Abstract
Based on the transfer-matrix method, we theoretically explore the transmission and reflection properties of light waves in a one-dimensional defective photonic crystal composed of superconductor (HgBa2Ca2Cu3O8+δ) and semiconductor (GaAs) layers. The [...] Read more.
Based on the transfer-matrix method, we theoretically explore the transmission and reflection properties of light waves in a one-dimensional defective photonic crystal composed of superconductor (HgBa2Ca2Cu3O8+δ) and semiconductor (GaAs) layers. The whole system is centrosymmetric and can generate a defect transmission peak in the photonic band gap. We study the effect of the temperature on the defect mode. Results obtained show that the defect mode shifts to the lower frequency regions as the value of the environmental temperature increases, and the resonance of the defect mode can be strengthened further as the number of periods increases. In addition, our findings reveal that the central wavelength of the defect mode increases with the increase in the environmental temperature and it presents a nearly linear relationship between the central wavelength of the defect mode and the temperature in cryogenic environments. Therefore, we can use the temperature response of the defect mode to detect the temperature. It is hoped that this study has potential applications for the development of cryogenic sensors with high sensitivity. Full article
(This article belongs to the Special Issue Wide-Bandgap Semiconductor Materials, Devices and Systems)
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10 pages, 2501 KiB  
Article
Simulation of High Breakdown Voltage, Improved Current Collapse Suppression, and Enhanced Frequency Response AlGaN/GaN HEMT Using A Double Floating Field Plate
by Peiran Wang, Chenkai Deng, Hongyu Cheng, Weichih Cheng, Fangzhou Du, Chuying Tang, Chunqi Geng, Nick Tao, Qing Wang and Hongyu Yu
Crystals 2023, 13(1), 110; https://doi.org/10.3390/cryst13010110 - 07 Jan 2023
Cited by 5 | Viewed by 2557
Abstract
In this paper, DC, transient, and RF performances among AlGaN/GaN HEMTs with a no field plate structure (basic), a conventional gate field plate structure (GFP), and a double floating field plate structure (2FFP) were studied by utilizing SILVACO ATLAS 2D device technology computer-aided [...] Read more.
In this paper, DC, transient, and RF performances among AlGaN/GaN HEMTs with a no field plate structure (basic), a conventional gate field plate structure (GFP), and a double floating field plate structure (2FFP) were studied by utilizing SILVACO ATLAS 2D device technology computer-aided design (TCAD). The peak electric fields under the gate in drain-side can be alleviated effectively in 2FFP devices, compared with basic and GFP devices, which promotes the breakdown voltage (BV) and suppresses the current collapse phenomenon. As a result, the ON-resistance increase caused by the current collapse phenomena is dramatically suppressed in 2FFP ~19.9% compared with GFP ~49.8% when a 1 ms duration pre-stress was applied with Vds = 300 V in the OFF-state. Because of the discontinuous FP structure, more electric field peaks appear at the edge of the FFP stacks, which leads to a higher BV of ~454.4 V compared to the GFP ~394.3 V and the basic devices ~57.6 V. Moreover, the 2FFP structure performs lower a parasitic capacitance of Cgs = 1.03 pF and Cgd = 0.13 pF than those of the GFP structure (i.e., Cgs = 1.89 pF and Cgd = 0.18 pF). Lower parasitic capacitances lead to a much higher cut-off frequency (ft) of 46 GHz and a maximum oscillation frequency (fmax) of 130 GHz than those of the GFP structure (i.e., ft = 27 GHz and fmax = 93 GHz). These results illustrate the superiority of the 2FFP structure for RF GaN HEMT and open up enormous opportunities for integrated RF GaN devices. Full article
(This article belongs to the Special Issue Wide-Bandgap Semiconductor Materials, Devices and Systems)
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10 pages, 3266 KiB  
Article
Numerical Modelling for the Experimental Improvement of Growth Uniformity in a Halide Vapor Phase Epitaxy Reactor for Manufacturing β-Ga2O3 Layers
by Galia Pozina, Chih-Wei Hsu, Natalia Abrikossova and Carl Hemmingsson
Crystals 2022, 12(12), 1790; https://doi.org/10.3390/cryst12121790 - 09 Dec 2022
Viewed by 1717
Abstract
The development of growth processes for the synthesis of high-quality epitaxial layers is one of the requirements for utilizing the ultrawide band gap semiconductor Ga2O3 for high-voltage, high-power electronics. A halide vapor phase epitaxy (HVPE) process used to grow β-Ga [...] Read more.
The development of growth processes for the synthesis of high-quality epitaxial layers is one of the requirements for utilizing the ultrawide band gap semiconductor Ga2O3 for high-voltage, high-power electronics. A halide vapor phase epitaxy (HVPE) process used to grow β-Ga2O3 layer was optimized by modifying the gas inlet, resulting in improved growth uniformity. A conventional tube acting as an inlet for the Ga precursor GaCl gas was replaced with a shower head with four outlets at 45 degrees to the horizontal axis of the reactor. The modification was performed based on numerical calculations of the three-dimensional distribution of gases inside the growth chamber with different designs of the GaCl precursor inlet. It was shown that variation in the Ga/O ratio over the substrate holder was ~10% for a shower head compared with ~40% for a tube. In addition, growth with a tube leads to the film thickness varying by a factor of ~4 depending on the position on the holder, whereas when using a shower head, the thickness of the grown Ga2O3 layers became much more uniform with a total spread of just ~30% over the entire substrate holder. Full article
(This article belongs to the Special Issue Wide-Bandgap Semiconductor Materials, Devices and Systems)
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