Special Issue "Advances in Data Capturing, Modeling, Simulation, and Analysis in Construction and the Built Environment"

A special issue of Buildings (ISSN 2075-5309). This special issue belongs to the section "Building Energy, Physics, Environment, and Systems".

Deadline for manuscript submissions: closed (31 July 2023) | Viewed by 404

Special Issue Editors

FET-Architecture and the Built Environment, University of the West of England, Bristol, UK
Interests: building information modeling; cloud computing; heritage; renewable and sustainable energy
Special Issues, Collections and Topics in MDPI journals
Department of Accounting, Economics and Finance, Faculty of Business and Law, University of the West of England (UWE), Bristol, UK
Interests: artificial intelligence; blockchain; machine learning; building energy modeling; building information modeling; sustainable buildings; renewable and sustainable energy
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Despite the rapid growth of modeling and simulation approaches, tools, and techniques in various industries, such as aerospace and manufacturing, their adoption in the context of the built environment has remained relatively modest.  However, recent advances in data collection, modeling, analysis, and simulation, as well as data science have paved the way for an increasing development and application of novel methods, tools, and techniques for capturing, modeling, visualizing, and analyzing construction and the built environment.

The aim of this Special Issue is to disseminate current and emerging cutting-edge research and developments in capturing, modeling, simulating, and analyzing new build and retrofitting projects, project lifecycle, as well as built heritage assets. Research that reports on beyond state-of-the-art approaches, tools, and techniques for data capturing (drones, laser and lidar scanning), modeling (scan/point cloud to building information modeling), simulating (virtual reality, augmented and mixed reality), and analyzing (big data, artificial intelligence, and machine learning) is particularly welcome.

Prof. Dr. Lamine Mahdjoubi
Dr. Xiaojun Luo
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Buildings is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • drones, laser and lidar scanning, point clouds, cloud computing
  • building information modelling, scan point cloud to BIM
  • Internet of Things/digital twins
  • virtual reality, augmented and mixed reality
  • artificial intelligence, machine learning, big data
  • new build, building retrofitting, project lifecycle, heritage BIM

Published Papers

There is no accepted submissions to this special issue at this moment.
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