Wearable and Implantable Electronics for the Next Generation of Human- Machine Interactive Devices

A special issue of Bioengineering (ISSN 2306-5354). This special issue belongs to the section "Biosignal Processing".

Deadline for manuscript submissions: 25 June 2024 | Viewed by 1253

Special Issue Editor

Micro-Nano Innovations (MiNI) Laboratory, Department of Biomedical Engineering, University of California, Davis, CA 95616, USA
Interests: sensors; wearable devices; health monitoring; functional materials; human-machine interaction

Special Issue Information

Dear Colleagues,

The recent advances in materials, novel electronics, and artificial intelligence are redefining the ways that humans exchange information with machines. The potential of human–machine interactive devices has expanded tremendously in the form of wearable and implantable devices, from monitoring vital biosignals and daily activity to establishing virtual interaction in prosthetic and robotic control. Therefore, this Special Issue, “Wearable and Implantable Electronics for the Next Generation of Human–Machine Interactive Devices”, will summarize and focus on recent studies and technologies in wearable and implantable devices and their uses in and impacts on various applications. Areas of interest for this Special Issue may include but are not limited to:

  • Novel materials for the wearable and implantable sensor applications;
  • Advanced fabrication technology in making wearable and implantable devices;
  • Energy harvesting technology and self-powered systems;
  • New advancements in implantable electronics for chronic disease monitoring and biosignal sensing;
  • Immersive wearables of virtual reality (VR) and augmented reality (AR);
  • Machine learning techniques for remote healthcare and personal monitoring.

Dr. Zijie Zhu
Guest Editor

Manuscript Submission Information

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Keywords

  • wearable devices
  • implantable devices
  • human-machine interaction
  • health care

Published Papers (1 paper)

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Research

19 pages, 12716 KiB  
Article
Thermal Cues Composed of Sequences of Pulses for Transferring Data via a Haptic Thermal Interface
by Yosef Y. Shani and Simon Lineykin
Bioengineering 2023, 10(10), 1156; https://doi.org/10.3390/bioengineering10101156 - 02 Oct 2023
Viewed by 792
Abstract
This research study is the preliminary phase of an effort to develop a generic data transfer method via human haptic thermal sensation (i.e., a coded language such as Morse or Braille). For the method to be effective, it must include a large variety [...] Read more.
This research study is the preliminary phase of an effort to develop a generic data transfer method via human haptic thermal sensation (i.e., a coded language such as Morse or Braille). For the method to be effective, it must include a large variety of short, recognizable cues. Hence, we propose the concept of cues based on sequences of thermal pulses: combinations of warm and cool pulses with several levels of intensity. The objective of this study was to determine the feasibility of basing a generic data transfer method on haptic thermal cues using sequences of short pulses. The research included defining the basic characteristics of the stimuli parameters and developing practical methods for generating and measuring them. Several patterns of different sequences were designed considering the relevant data known to date and improved by implementing new insights acquired throughout the tests that were conducted. The final thermal cues presented to the participants were sensed by touch and clearly recognized. The results of this study indicate that developing this new method is feasible and that it could be applicable in various scenarios. In addition, the low impact measured on the user’s skin temperature represents an inherent advantage for future implementation. This report presents promising findings and offers insights for further investigations. Full article
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