Selected papers from IEEE ICASI 2019

A special issue of Applied System Innovation (ISSN 2571-5577).

Deadline for manuscript submissions: closed (31 August 2019) | Viewed by 595

Special Issue Editors


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Guest Editor
Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan
Interests: optical and electronic devices; semi-conductive materials; nanotechnology
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Guest Editor
Department of Electronic Engineering, National United University, Miaoli City 36063, Taiwan
Interests: semiconductor physics; optoelectronic devices; nanotechnology
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Guest Editor
Aeronautics, Astronautics and Computational Engineering, University of Southampton, Southampton SO16 7QF, UK
Interests: microsystem design; nanotechnology
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Guest Editor
Department of Electro-Optical Engineering, National Formosa University, Yunlin, Taiwan
Interests: nano-optoelectronics; photo detector; nanomaterials
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Special Issue Information

Dear Colleagues,

The 5th IEEE International Conference on Applied System Innovation 2019 (IEEE ICASI 2019, https://2019.icasi-conf.net/) will be held in Fukuoka, Japan on April 11–15, 2019. It will provide a unified communication platform for a wide range of topics. This Special Issue on “Selected Papers from TIKI IEEE ICASI 2019” is expected to select excellent papers presented at TIKI IEEE ICASI 2019 regarding the topic of “Applied System Innovation”. Mechanical engineering and design innovations are both academic and practical engineering fields, which involve systematic technological materialization through scientific principles and engineering designs. Technological innovation through mechanical engineering includes IT-based intelligent mechanical systems, mechanics and design innovations, and applied materials in nanosciences and nanotechnology. The main goal of this Special Issue is to discover new scientific knowledge relevant to IT-based intelligent mechanical systems, mechanics and design innovations, and applied materials in nanosciences and nanotechnology. We invite investigators interested in applied system innovation to contribute their original research articles to this Special Issue. Potential topics include but are not limited to:

  • Intelligent mechanical manufacturing systems;
  • Mathematical problems on mechanical system designs;
  • Smart electromechanical system analysis and design;
  • Applied materials in nanosciences and nanotechnology;
  • Computer-aided methods for mechanical design procedure and manufacture;
  • Computer and human–machine interaction;
  • Internet Technology on mechanical system innovation;
  • Machine diagnostics and reliability;
  • Human–machine interaction/virtual reality and entertainment.

Schedule:

Manuscript Due: August 31, 2019
First Round of Reviews: September 15, 2019
Second Round of Reviews: October 31, 2019
Acceptance of Final Papers and Publication: November 30, 2019

Prof. Dr. Shoou-Jinn Chang
Prof. Dr. Sheng-Joue Young
Dr. Stephen D. Prior
Prof. Dr. Liang-Wen Ji
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied System Innovation is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Advanced materials
  • Microelectronic devices
  • Optical sensors

Published Papers

There is no accepted submissions to this special issue at this moment.
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