Advanced Micro/Nano Device and System Technology
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Mechanical Engineering".
Deadline for manuscript submissions: closed (20 July 2023) | Viewed by 226
Special Issue Editor
2. National Key Laboratory of Fundamental Science of Novel Micro/Nano Device and System Technology, Chongqing University, Chongqing 400030, China
Interests: fluid-structure interaction; MEMS design; vibration analysis; piezoelectricity; energy harvesting
Special Issue Information
Dear Colleagues,
The rapid development of modern information technology, biotechnology, energy, environment and advanced manufacturing technology has put forward new requirements for intelligent sensor components and systems. Micro-nano technology-based advanced Micro/Nano Device and System have become the future development direction due to their remarkable characteristics of miniaturization, intelligence, high integration and high density.
Micro/nano-Electro-Mechanical System technology is an integrated technology after cross-disciplinary integration, which including physics, chemistry, materials, mechanics, etc. The sensitive material, mechanical structures, actuators, sensors, and related circuits are integrated into a single chip to form an intelligent miniaturized system with a specific function through Micro-nano fabrication technology and 3D heterogeneous integration technology. It involves a variety of technologies such as device design, micro-nano film deposition and patterned, wafer bonding, silicon interconnection, three-dimensional intergration, system packaging and device characterization technology. The newly emerging nano-technological advancements, such as quantum effects, interface effects and nanoscale effects, have provided new impetus for the next generation of micro and nano devices and systems.
This special issue is dedicated to organizing and summarizing the current research status of advanced micro-nano devices and systems and sharing the latest progresses in the field of advanced micro-nano device and system research. Original research achievements and review literature from the fields of Working principles, new design concepts, MEMS fabrication technology, system integration method, on-chip control technology, etc., related to micro-nano devices and technology are all welcomed.
Prof. Dr. Quan Wen
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- micro mechanical and electrical system
- intelligent sensor
- sensing principle
- device design
- micro-nano fabrication technology
- smart system integration
- 3D heterogeneous/heteromaterial integration
- wafer-level bonding
- silicon interconnection for 3D packaging
