Advances in Flexible Printed Electronics
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Electrical, Electronics and Communications Engineering".
Deadline for manuscript submissions: closed (20 November 2023) | Viewed by 260
Special Issue Editor
Interests: optoelectronic devices; low-power sensors; skin and tissue compatible electronics; physiological biosensors
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Flexible printed electronics provide great potential for various applications, including human motion monitoring, artificial electronic skin, and wearable devices. Over the past few years, extensive achievements have been made in flexible printed electronics, from concept and fabrication to advanced applications. However, the demand for high-quality flexible electronics with high-resolution printing technologies, and for the scalable fabrication of electronics, is ever-increasing. Therefore, this Special Issue, titled “Advances in Flexible Printed Electronics”, is focused on the recent advances in design principles and fabrication methods of printed electronics with excellent mechanical properties, as well as their promising application in flexible biosensors.
In this Special Issue, we invite authors to submit original communications, research articles, and reviews on materials, fabrication technologies, sensing devices, and healthcare applications where printed and flexible electronics are involved. These works are expected to be useful and helpful for the evaluation of flexible printed electronics.
The scope of this Special Issue includes:
- Flexible and stretchable components (electronic materials);
- Wearable devices, sensors, and conductors;
- Skin/tissue-compatible biological monitoring devices;
- Printing methods for electronics;
- Large-area and high-throughput fabrication methods;
- New methodologies and concepts for processing printed electronics.
Dr. Sungjun Park
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- flexible materials
- stretchable materials
- smart sensors
- wearable devices
- large-area printing
