Applied Sciences in 2021

A special issue of Applied Sciences (ISSN 2076-3417).

Deadline for manuscript submissions: closed (31 March 2022) | Viewed by 1309

Special Issue Editors


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Guest Editor
Advanced Ultrafast Laser Research Center, The University of Electro-Communications, 1-5-1, Chofugaoka, Chofu, Tokyo 182-8585, Japan
Interests: ultrafast and nonlinear optical processes; quantum optics; quantum photobiology
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Guest Editor
Department of Energy Technology, Aalborg University, 9220 Aalborg, Denmark
Interests: power electronics and its applications in motor drives; wind turbines; PV systems; harmonics; reliability of power electronic systems
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Department of Chemical Engineering, Materials and Environment, Sapienza University of Rome, 00184 Rome, Italy
Interests: fatigue and fracture behavior of materials; mechanical characterization; structural integrity of conventional and innovative materials
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Department of Engineering and Architecture, University of Parma, Parco Area delle Scienze, 181/A, 43124 Parma, Italy
Interests: video surveillance; mobile vision; visual sensor networks; machine vision; multimedia and video processing; performance analysis of multimedia computer architectures
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

We are pleased to announce this Special Issue, entitled “Applied Sciences in 2021”, which is part of the MDPI journal New Year Special Issue Series. This Special Issue will be a collection of high-quality reviews from Editorial Board Members, Guest Editors, Topical Advisory Panel Members, Reviewer Board Members, previous authors and reviewers, in addition to excellent editorials from EiCs and Section EiCs.

Submissions on all aspects of applied physics, applied chemistry, engineering, environmental and earth sciences, and applied biology are all welcomed.

Prof. Dr. Takayoshi Kobayashi
Prof. Dr. Frede Blaabjerg
Prof. Dr. Filippo Berto
Prof. Dr. Andrea Prati
Prof. Dr. Roger Narayan
Guest Editors

New Year Special Issue Series

This Special Issue is a part of Applied Sciences’s New Year Special Issue Series. The series reflects on the achievements, scientific progress, and “hot topics” of the previous year in the journal. Submissions of articles whose lead authors are our Editorial Board Members are highly encouraged. However, we welcome articles from all authors.

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers

There is no accepted submissions to this special issue at this moment.
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