Technical Advances in Semiconductor Process

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Electrical, Electronics and Communications Engineering".

Deadline for manuscript submissions: 20 August 2024 | Viewed by 149

Special Issue Editors

Department of Electronic Engineering, Kyonggi University, Gyeonggi-do 154-42, Republic of Korea
Interests: semiconductor process; dispersion; adsorption; electrochemistry; nanoparticle synthesis
Special Issues, Collections and Topics in MDPI journals
Dr. Kiho Bae
E-Mail Website
Guest Editor
Semiconductor R&D Center, Samsung Electronics, Hwaseong 18448, Republic of Korea
Interests: semiconductor process; chemical mechanical planarization; process integration; slurry engineering; surface chemistry

Special Issue Information

Dear Colleagues,

The development of nanoscale semiconductor processing has been driven by the structural innovation of devices and application of new materials for the last two decades. Especially, in the era of sub-3 nm gate-all-around field-effect-transistor (GAAFET) devices, as the contact poly pitch (CPP) is reduced to less than 45 nm, research on the advanced technologies, such as  EUV-based nanopatterning processes, novel metal processes with low resistance, and inventive scheme processes (i.e., BSPDN: Back Side Power Delivery Network), have garnered notable attention in realizing next-generation semiconductor devices.

This Special Issue will cover recent advances and comprehensive strategies in our fundamental understanding, advanced technologies, and new material development, with a focus on semiconductor processing for next-generation technology nodes. This will bring together a diverse set of leading researchers and engineers from academia to industry who focus on new materials, advances in materials characterization, material design, process modeling, and fundamental science in the semiconductor manufacturing field.

Dr. Kangchun Lee
Dr. Kiho Bae
Guest Editors

Manuscript Submission Information

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • semiconductor processing
  • patterning process
  • thin film process
  • process integration
  • defect

Published Papers

This special issue is now open for submission.
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