Reprint

Applications of Crystal Plasticity in Forming Technologies

Edited by
November 2022
242 pages
  • ISBN978-3-0365-5733-5 (Hardback)
  • ISBN978-3-0365-5734-2 (PDF)

This book is a reprint of the Special Issue Applications of Crystal Plasticity in Forming Technologies that was published in

Chemistry & Materials Science
Engineering
Environmental & Earth Sciences
Summary

In this Special Issue, we have gathered work on simulations of polycrystalline metals and alloys at various length scales to model multiscale localization phenomena such as slip bands, cracks, and twins. The series highlights innovative techniques that combine simulation and experiments to capture material production and guide the development of forming theories. The published work helps to understand the effect of microstructure characteristics on deformation and damage behavior under multiaxial load conditions. Furthermore, these models and the studies can be used with machine learning technologies to optimize microstructure functions for materials application and process paths.

Format
  • Hardback
License
© 2022 by the authors; CC BY-NC-ND license
Keywords
crystal plasticity; twinning; detwinning; dislocation; X-ray diffraction; SEM-DIC; Magnesium; plastic crystals; Raman spectroscopy; low temperature; high-pressure; L-Leucinium hydrogen maleate; plasticity; bending crystal; damage mechanics; crystal plasticity; numerical simulation; local deformation behavior; in situ tensile test; VEDDAC; DAMASK; digital image correlation; non-metallic inclusions; discrete dislocation dynamics; finite element method; multiscale model; size effects; magnesium alloy; slip transfer; crystallographic misorientation; ductility; multilevel models; dynamic recrystallization; grain shape and grain size; defect and grain structure evolution; crystal plasticity; DAMASK; representative volume element; least square method; alternative error method; dual-phase steel; magnesium alloy; ductility; grain boundary; characteristics; electron microscopy; cubic quasicrystal piezoelectric materials; crack; screw dislocation; complex variable function method; aluminum wires; overhead power transmission lines; XRD; EBSD; densitometry; elastoplastic properties; density; near-surface layer; solder joints; lead-free; reliability; creep; fatigue; n/a